rus
Competent opinion
Exhibitions & Conferences
M.Sheykin
Conference “Embedded Systems 2011” New Horizons with Windows Embedded April 21 2011 the fourth international conference “Embedded technologies. Modern software and hardware solutions 2011”. The main goal of the conference was specialists and designers familiarization with OS Microsoft Windows Embedded family new capabilities and with embedded systems design technology on the basis of this platform. The conference was organized by “Quarta Technology” with the support of Microsoft. The conference attended more then 200 specialists and more then 15 companies partners presented turnkey solutions for embedded systems.
Conference “Embedded Systems 2011” New Horizons with Windows Embedded April 21 2011 the fourth international conference “Embedded technologies. Modern software and hardware solutions 2011”. The main goal of the conference was specialists and designers familiarization with OS Microsoft Windows Embedded family new capabilities and with embedded systems design technology on the basis of this platform. The conference was organized by “Quarta Technology” with the support of Microsoft. The conference attended more then 200 specialists and more then 15 companies partners presented turnkey solutions for embedded systems.
Economy & Business
M.Makushin
And the Sea the Earth Trembling Settled Down…. Unto the Earthquake Effects in Japan The developments in Japan showed that not only modern civilization is highly vulnerable to natural elements. It turned out that a major part of semiconductor and OEM production that because of economic reasons was moved to Asian-Pacific Region occurred in the zone of high seismic activity. What are the Japan earthquake consequences (particularly for production politics and new enterprises allocations planning) on electronics market conditions? Lets try to estimate them.
And the Sea the Earth Trembling Settled Down…. Unto the Earthquake Effects in Japan The developments in Japan showed that not only modern civilization is highly vulnerable to natural elements. It turned out that a major part of semiconductor and OEM production that because of economic reasons was moved to Asian-Pacific Region occurred in the zone of high seismic activity. What are the Japan earthquake consequences (particularly for production politics and new enterprises allocations planning) on electronics market conditions? Lets try to estimate them.
Tags: earthquake victims recovery progress supply chain failures жертвы землетрясения меры по восстановлению нарушении цепи поставок
Electronic Components
I.Tarasov
FPGA Xilinx and Digital signal processing. Advantages, Peculiar Properties and Trends One of the key requirements of digital signal processing is high performance. High performance can be attained by suitable for implantation on FPGA parallel calculations. Xilinx’s last generation FPGAs permit to perform more effective DSP algorithms then signal processors. Performance is considerably increased due to parallel function of FPGA hardware. For DSP systems Xilinx offers new FPGA Kintex-7 that will be produced in the immediate future.
FPGA Xilinx and Digital signal processing. Advantages, Peculiar Properties and Trends One of the key requirements of digital signal processing is high performance. High performance can be attained by suitable for implantation on FPGA parallel calculations. Xilinx’s last generation FPGAs permit to perform more effective DSP algorithms then signal processors. Performance is considerably increased due to parallel function of FPGA hardware. For DSP systems Xilinx offers new FPGA Kintex-7 that will be produced in the immediate future.
N.Eliseev, M.Salov
Analog Devices series AD719x ADC. High Resolution and Ultralow Noise Analog Devices is a well known ADC products word leader. Its models include a hole spectrum of ADCs with various speed, conversion accuracy and extra functions. Among them a new family of precision Σ∆ ADC, the ultralow noise AD719x, deserves consideration.
Analog Devices series AD719x ADC. High Resolution and Ultralow Noise Analog Devices is a well known ADC products word leader. Its models include a hole spectrum of ADCs with various speed, conversion accuracy and extra functions. Among them a new family of precision Σ∆ ADC, the ultralow noise AD719x, deserves consideration.
I.Romanova
Belden’s Cables for Industrial Networks. Russian Market Offers assortment (more then 3000 cables and wire types) for computer networks, telecommunication systems, industrial instrumentation, broadcasting equipment, cable TV, electronic systems, coils wire. The Belden’s cables wide range of choice can be delivered as custom products with high resistance to mechanical, chemical, radiation and thermal stresses. The company also produces specific industrial driving, control, thermocouple cables and others. These cable groups are offered in a series of industrial cables for solution of a wide range of tasks in various production fields – from shipbuilding to oil and mineral production.
Belden’s Cables for Industrial Networks. Russian Market Offers assortment (more then 3000 cables and wire types) for computer networks, telecommunication systems, industrial instrumentation, broadcasting equipment, cable TV, electronic systems, coils wire. The Belden’s cables wide range of choice can be delivered as custom products with high resistance to mechanical, chemical, radiation and thermal stresses. The company also produces specific industrial driving, control, thermocouple cables and others. These cable groups are offered in a series of industrial cables for solution of a wide range of tasks in various production fields – from shipbuilding to oil and mineral production.
I.Vikulov
European Microwave and RF Electronics Modernization Programs. Comment Microwave Journal, 2010, №10 published an article of European Defence Agency official representatives “On the Right Wavelength: Microwave and RF Technology For Defence”. It reflects the increasing requirements for electronic high frequency (<1 GHz) and microwave (> 1 GHz) devices that increase efficiency manifold. One of objects of the article is to show that the development of Microwave and RF Technology in Europe follows the global trends and thereby justifies European countries military expenditures. Though the article doesn’t present development programs concrete parameters it is of interest as it characterizes at large the directions and numerous EDA international Microwave and RF Technology military programs. Lets examine the article’s main statements.
European Microwave and RF Electronics Modernization Programs. Comment Microwave Journal, 2010, №10 published an article of European Defence Agency official representatives “On the Right Wavelength: Microwave and RF Technology For Defence”. It reflects the increasing requirements for electronic high frequency (<1 GHz) and microwave (> 1 GHz) devices that increase efficiency manifold. One of objects of the article is to show that the development of Microwave and RF Technology in Europe follows the global trends and thereby justifies European countries military expenditures. Though the article doesn’t present development programs concrete parameters it is of interest as it characterizes at large the directions and numerous EDA international Microwave and RF Technology military programs. Lets examine the article’s main statements.
M.Zibin
Non-Heated Magnetrons. Yesterday, Today, Tomorrow. One of the significant achievements of the last 30 years in vacuum microwave devices development and production was creation and commercial production of non-heated magnetrons in other words with non-heated or “cold” cathode. The article reviews their main advantages. applications and future development.
Non-Heated Magnetrons. Yesterday, Today, Tomorrow. One of the significant achievements of the last 30 years in vacuum microwave devices development and production was creation and commercial production of non-heated magnetrons in other words with non-heated or “cold” cathode. The article reviews their main advantages. applications and future development.
Tags: cold cathode microwave electronics non-heated magnetron безнакальный магнетрон свч-электроника холодный катод
Test & Measurements
D.Serkov
Precision High Frequency Synthesizers FSW: High Processing Speed and Multifuntionality Precision High Frequency Synthesizers FSW: High Processing Speed and Multifuntionality
Frequency synthesizers are devices generating a continuous signal with variable frequency and power on the reference generator harmonic oscillations basis. They are widely used in many applications: from commercial networks and telecommunication systems to last generation instrumentation. This article concerns Phase Matrix’s (USA) new precision high frequency synthesizers FSW-0010 and FSW-0020.
Precision High Frequency Synthesizers FSW: High Processing Speed and Multifuntionality Precision High Frequency Synthesizers FSW: High Processing Speed and Multifuntionality
Frequency synthesizers are devices generating a continuous signal with variable frequency and power on the reference generator harmonic oscillations basis. They are widely used in many applications: from commercial networks and telecommunication systems to last generation instrumentation. This article concerns Phase Matrix’s (USA) new precision high frequency synthesizers FSW-0010 and FSW-0020.
G.Trapashko
Micro Dimensions Control in the ICs manufacture. Goals and Features Photolithography is a key technologic progress in the manufacture of semiconductor devices and ICs. Its main purpose is to transfer the original IC topology on the semiconductor wafer surface/ ICs characteristics depend on precision of producing their minimal features. The goal of photolithography is to provide quality implementation of these features on the whole wafer array with due attention to hold the tolerable elements dimension deviations and their position relative to underlying structures that were formed by the previous process.
Micro Dimensions Control in the ICs manufacture. Goals and Features Photolithography is a key technologic progress in the manufacture of semiconductor devices and ICs. Its main purpose is to transfer the original IC topology on the semiconductor wafer surface/ ICs characteristics depend on precision of producing their minimal features. The goal of photolithography is to provide quality implementation of these features on the whole wafer array with due attention to hold the tolerable elements dimension deviations and their position relative to underlying structures that were formed by the previous process.
Tags: critical dimensions control photolithography precision контроль критических размеров точность фотолитография
New Technologies
M.Goltsova
ISSCC 2011. From Large Scale ICs to Implanted Devices Feb. 20–24 at San Francisco was held one of the first class semiconductor electronics forums, International Solid State Circuits Conference, ISSCC 2011. The conference theme was Electronics for healthy living. This theme obviously means that semiconductor industry indents to gain a foothold in a new territory for the purpose of increasing its revenues. But in spite of biomedical electronics large capacities a conference of such a scale as ISSCC can’t concentrate its attention only to this theme. As well to render medical care at home whether than at a hospital there is a need for ultra small processors, transceivers, batteries, energy harvesting devices, data interpretation and presentation. That’s why high attention was devoted to new developments of ordinary semiconductor devices that can find applications in future medical electronics.
ISSCC 2011. From Large Scale ICs to Implanted Devices Feb. 20–24 at San Francisco was held one of the first class semiconductor electronics forums, International Solid State Circuits Conference, ISSCC 2011. The conference theme was Electronics for healthy living. This theme obviously means that semiconductor industry indents to gain a foothold in a new territory for the purpose of increasing its revenues. But in spite of biomedical electronics large capacities a conference of such a scale as ISSCC can’t concentrate its attention only to this theme. As well to render medical care at home whether than at a hospital there is a need for ultra small processors, transceivers, batteries, energy harvesting devices, data interpretation and presentation. That’s why high attention was devoted to new developments of ordinary semiconductor devices that can find applications in future medical electronics.
Tags: medical electronics problems new processors новые процессоры. проблемы медицинской электроники
V.Shurigina
Future Printed Electronics. Reality or Fantasy? The semiconductor industry took more then forty years to approach $300 million business today. Now there is a new form of electronics, and not only electronics but electrics too, that will hit this figure in half the time. It is printed electronics. Their main feature is physical flexibility by virtue of you can print electronic devices on everyday substrates (including paper), bend, stretch, roll them up, embed in cloth etc. Therefore a previously unobtainable capability to realize a great number of electronic and electric devices appeared. Early Roadmaps were wrong. The goals of printed electronics today are not only cost reduction and improvement of current devices but future printed electronics technology design. So what are the new trends of printed electronics?
Future Printed Electronics. Reality or Fantasy? The semiconductor industry took more then forty years to approach $300 million business today. Now there is a new form of electronics, and not only electronics but electrics too, that will hit this figure in half the time. It is printed electronics. Their main feature is physical flexibility by virtue of you can print electronic devices on everyday substrates (including paper), bend, stretch, roll them up, embed in cloth etc. Therefore a previously unobtainable capability to realize a great number of electronic and electric devices appeared. Early Roadmaps were wrong. The goals of printed electronics today are not only cost reduction and improvement of current devices but future printed electronics technology design. So what are the new trends of printed electronics?
Tags: paper electronics printable copper inks production equipment бумажная электроника медные пасты промышленное оборудование
G.Nikolaytchuk, V.Ivanov, E.Ivanov
Ferromagnetic Films for Semiconductor Spin anotechnology New generation nanoelectronics spin UHF devices have a heterogeneous structure. They are notable for their multifunctional performance (combine filtration, signal delay and other functions), high speed parameters control and easy integration with radiosystems. The main element of a spinwave device is a wave guiding line the basis of which is a YIG film of Y3Fe5O12.
Ferromagnetic Films for Semiconductor Spin anotechnology New generation nanoelectronics spin UHF devices have a heterogeneous structure. They are notable for their multifunctional performance (combine filtration, signal delay and other functions), high speed parameters control and easy integration with radiosystems. The main element of a spinwave device is a wave guiding line the basis of which is a YIG film of Y3Fe5O12.
Tags: ferromagnetic films process spin electronics спиновая электроника технология получения ферромагнитных пленок
A.Maksimov
Multilayer Ceramic-Metal Packages: Their Advantages and Peculiar Properties LTCC (Low Temperature Cofired Ceramics) and HTCC (High Temperature Cofired Ceramics) packages are widely used in various industrial branches (medical, automobile, etc.) and also in space and military technique. This article concerns multilayer HTCC packages advantages, peculiar properties and production stages are discussed.
Multilayer Ceramic-Metal Packages: Their Advantages and Peculiar Properties LTCC (Low Temperature Cofired Ceramics) and HTCC (High Temperature Cofired Ceramics) packages are widely used in various industrial branches (medical, automobile, etc.) and also in space and military technique. This article concerns multilayer HTCC packages advantages, peculiar properties and production stages are discussed.
S.Kataev, V.Sidorov, S.Gordeev
Diamond-Carbide Composition Material “Skeleton” for Electronic Devices Heat Sinks High power electronic devices designers give special attention to heat rejection. Heat rejection is due to thermal conductivity, thermal radiation and convection. In real world this three different in principle ways of heat transfer are closely related to each other and become apparent simultaneously. However the primary part in the heat rejection process plays thermal conductivity. That’s why one of paths to efficiently remove heat in high power electronic devices is extensively use of heat sinks made from high thermal conductive materials. Electronics commonly uses oxide beryllium ceramic that is remarkable for its high termo conductivity and high dielectric properties. Nitride-alumina ceramic and polycrystalline diamond get under way and today they may be considered as the most promising materials for semiconductor devices heat sinks. Along with them ecologically clean high thermo conductive diamond-carbide composite material “Skeleton” is met with approval.
Diamond-Carbide Composition Material “Skeleton” for Electronic Devices Heat Sinks High power electronic devices designers give special attention to heat rejection. Heat rejection is due to thermal conductivity, thermal radiation and convection. In real world this three different in principle ways of heat transfer are closely related to each other and become apparent simultaneously. However the primary part in the heat rejection process plays thermal conductivity. That’s why one of paths to efficiently remove heat in high power electronic devices is extensively use of heat sinks made from high thermal conductive materials. Electronics commonly uses oxide beryllium ceramic that is remarkable for its high termo conductivity and high dielectric properties. Nitride-alumina ceramic and polycrystalline diamond get under way and today they may be considered as the most promising materials for semiconductor devices heat sinks. Along with them ecologically clean high thermo conductive diamond-carbide composite material “Skeleton” is met with approval.
Tags: diamond-silicon carbide-silicon composite material unshrinkable technology безусадочная технология композиционный материал алмаз-карбид кремния-кремний
A.Vorobyev, A.Galdetskyi
Power Microwave Transistor Effective Heat Sink Implementation by Means of a Stop-Layer Structure One of the main objectives of microwave electronics development is to increase single devices power. GaAs microwave devices power is limited by their large heat resistance that is greatly due to the GaAs substrate poor thermal conductivity. To improve power microwave transistors heat rejection a new transistor construction is proposed. Computational modeling of its thermal conditions showed effectiveness of the proposed construction.
Power Microwave Transistor Effective Heat Sink Implementation by Means of a Stop-Layer Structure One of the main objectives of microwave electronics development is to increase single devices power. GaAs microwave devices power is limited by their large heat resistance that is greatly due to the GaAs substrate poor thermal conductivity. To improve power microwave transistors heat rejection a new transistor construction is proposed. Computational modeling of its thermal conditions showed effectiveness of the proposed construction.