rus
Competent opinion
Exhibitions & Conferences
Event of Issue
Year’s topic: the domestic production
D.Danilenko, L.Vorontsov
Next generation backplanes for onboard computer systems The article considers the solutions for new generation backplanes for onboard aviation and space-based computer systems. The microelectronics and photonics process steps and equipment were used when creating the backplane prototypes. It enabled to improve the operational characteristics of the products significantly.
Next generation backplanes for onboard computer systems The article considers the solutions for new generation backplanes for onboard aviation and space-based computer systems. The microelectronics and photonics process steps and equipment were used when creating the backplane prototypes. It enabled to improve the operational characteristics of the products significantly.
Tags: 3d micro system (3dms) 3d-микросистема (3dms) backplane onboard computer system бортовой вычислительный комплекс кросс-плата
Manufacturing Management
A.Zavalko, N.Kravtsov
Process control, moving to smart systems The article considers state-of-the-art process control SIAM (Smart Industrial Asset Management) class systems. It reviews the application examples of SINTIZ hardware and software system from OSTEK-CMT (OSTEK Group companies) at the Russian enterprises.
Process control, moving to smart systems The article considers state-of-the-art process control SIAM (Smart Industrial Asset Management) class systems. It reviews the application examples of SINTIZ hardware and software system from OSTEK-CMT (OSTEK Group companies) at the Russian enterprises.
Tags: production management siam-system siam-система software and hardware system программно-аппаратный комплекс управление производством
CAD
V.Ezhov
Advanced simulation of analog and digital circuits with OrCAD PSpice. According to PCB SOFT’s workshop proceedings The PCB SOFT workshop have discussed the advanced simulation of analog and digital circuits in OrCAD PSpice from Cadenсe.
Advanced simulation of analog and digital circuits with OrCAD PSpice. According to PCB SOFT’s workshop proceedings The PCB SOFT workshop have discussed the advanced simulation of analog and digital circuits in OrCAD PSpice from Cadenсe.
Tags: cadenсe orcad capture pspice simulation of analog and digital circuits моделирование аналоговых и цифровых схем
Electronic Components
N.Egorov, V.Kochemasov
Digital Radio Frequency Memory and its use in electronic warfare systems The article considers the technology of Digital Radio Frequency Memory (DRFM) and various devices based on it. It is noted that the use of DRFM systems enable to counteract state-of-the-art radars effectively. These systems are developing actively and will be able to provide even more opportunities for solving the electronic warfare tasks in the future.
Digital Radio Frequency Memory and its use in electronic warfare systems The article considers the technology of Digital Radio Frequency Memory (DRFM) and various devices based on it. It is noted that the use of DRFM systems enable to counteract state-of-the-art radars effectively. These systems are developing actively and will be able to provide even more opportunities for solving the electronic warfare tasks in the future.
T.Arents
LPDDR4 memory from Samsung, effective solutions for various applications The article considers Samsung LPDDR4 type random-access memory in particular recently developed 8 GB LPDDR4 module. It describes the advantages of LPDDR4 memory compared to previous generations memory specifically its high throughput and energy efficiency.
LPDDR4 memory from Samsung, effective solutions for various applications The article considers Samsung LPDDR4 type random-access memory in particular recently developed 8 GB LPDDR4 module. It describes the advantages of LPDDR4 memory compared to previous generations memory specifically its high throughput and energy efficiency.
Tags: energy efficiency lpddr4 module lpddr4-модуль random-access memory throughput оперативная память пропускная способность энергоэффективность
M.Makushin, V.Martynov, Y.Sukhoroslova
The paradigm of paradigms or Internet of Things The article analyzes the economic and technical preconditions for the emergence of the Internet of Things, IoT applications, the problems of IoT concept implementation and IoT technology development (standardization, cloud computing and security, server performance).
The paradigm of paradigms or Internet of Things The article analyzes the economic and technical preconditions for the emergence of the Internet of Things, IoT applications, the problems of IoT concept implementation and IoT technology development (standardization, cloud computing and security, server performance).
Test & Measurements
N.Lemeshko, V.Petrov, O.Povetkin, D.Bogachenkov
Integrated solutions for electromagnetic compatibility test on the basis of the R&S EMC32 software The article reviews one of the latest versions of the Rohde & Schwarz EMC32 software platform which enable to fully automate the EMC measurement and testing according to the requirements of operating standards.
Integrated solutions for electromagnetic compatibility test on the basis of the R&S EMC32 software The article reviews one of the latest versions of the Rohde & Schwarz EMC32 software platform which enable to fully automate the EMC measurement and testing according to the requirements of operating standards.
Tags: electromagnetic compatibility r&s emc32 r&s emc32 platform special software специальное программное обеспечение электромагнитная совместимость
Microwave electronics
K.Dzhurinsky, A.Androsov
6 GHz foreign connectors having no domestic equivalents Part 2. MCX and MMCX connectors The article considers the design and basic parameters of MCX and MMCX RF connectors with maximum frequency of 6 GHz having no domestic counterparts. The authors analyzed the products of main manufacturers of MCX and MMCX connectors and showed the possibility of their use in microwave devices.
6 GHz foreign connectors having no domestic equivalents Part 2. MCX and MMCX connectors The article considers the design and basic parameters of MCX and MMCX RF connectors with maximum frequency of 6 GHz having no domestic counterparts. The authors analyzed the products of main manufacturers of MCX and MMCX connectors and showed the possibility of their use in microwave devices.
N.Egorov
High quality RF/microwave devices for various applications – SignalCore’s products The article reviews the various RF/microwave devices from SignalCore: signal sources, frequency converters, quadrature modulators and demodulators, distribution amplifiers. It is noted that SignalCore's products might be of interest to Russian companies working in the field of development and operation of equipment for radio systems for critical applications.
High quality RF/microwave devices for various applications – SignalCore’s products The article reviews the various RF/microwave devices from SignalCore: signal sources, frequency converters, quadrature modulators and demodulators, distribution amplifiers. It is noted that SignalCore's products might be of interest to Russian companies working in the field of development and operation of equipment for radio systems for critical applications.
Tags: distribution amplifiers frequency converters quadrature modulators and demodulators signal sources источники сигналов квадратурные модуляторы и демодуляторы преобразователи частоты усилители-распределители
PCB
K.Tikhomirov, S.Alekseev
Solder joints reliability prediction. Thermo-mechanical fatigue: failure criteria, classification of the models The second article of the series. The article shows the weakness of the common methods of analytical prediction of fatigue strength of solder joints. It describes the methods to identify failure of solder joints according to the criteria of electrical resistance. The article reviews the classification of thermo-mechanical fatigue solder joints failure models as well as factors to consider when choosing the model.
Solder joints reliability prediction. Thermo-mechanical fatigue: failure criteria, classification of the models The second article of the series. The article shows the weakness of the common methods of analytical prediction of fatigue strength of solder joints. It describes the methods to identify failure of solder joints according to the criteria of electrical resistance. The article reviews the classification of thermo-mechanical fatigue solder joints failure models as well as factors to consider when choosing the model.
Tags: fatigue life solder joint failure solder joints thermo-mechanical fatigue отказ паяного соединения паяные соединения термомеханическая усталость усталостная долговечность
Electronics History