rus
Competent opinion
Event of Issue
NEWS
Engineering solutions
A.Sokolsky, М.Sokolsky
On the prevention of electrochemical migration in printed circuit boards of avionics The article presents the investigation of moisture condensation conditions on a printed circuit board with subsequent running of electrochemical migration process leading to the formation of parasitic bridges between conductors. The method is proposed for preventing this phenomenon by introducing the layer to the board structure that performs its controlled heating. The results of the tests are presented.
On the prevention of electrochemical migration in printed circuit boards of avionics The article presents the investigation of moisture condensation conditions on a printed circuit board with subsequent running of electrochemical migration process leading to the formation of parasitic bridges between conductors. The method is proposed for preventing this phenomenon by introducing the layer to the board structure that performs its controlled heating. The results of the tests are presented.
Tags: avionics dendrites electrochemical migration failure prevention moisture condensation printed circuit boards short circuit авионика дендриты конденсация влаги короткое замыкание печатные платы предотвращение отказов электрохимическая миграция
K.Khairnasov
Radio-electronic equipment of space vehicles: simulation and thermal analysis The article presents the results of research based on numerical methods of thermal conditions of onboard radio-electronic equipment intended for operation in nonpressurized modules of space vehicles. It is shown that the introduction of additional copper layers into the structure of multilayer printed circuit boards provides the temperature values met the specification of heat-stressed components.
Radio-electronic equipment of space vehicles: simulation and thermal analysis The article presents the results of research based on numerical methods of thermal conditions of onboard radio-electronic equipment intended for operation in nonpressurized modules of space vehicles. It is shown that the introduction of additional copper layers into the structure of multilayer printed circuit boards provides the temperature values met the specification of heat-stressed components.
Tags: finite element method mathematical simulation radio-electronic equipment space vehicles космические аппараты математическое моделирование метод конечных элементов радиоэлектронная аппаратура
Manufacturing Management
A.Shkodin
Non-lean production The article considers a number of methods of production management including the concept of so-called lean production. The advantages and disadvantages of various systems of production management are noted.
Non-lean production The article considers a number of methods of production management including the concept of so-called lean production. The advantages and disadvantages of various systems of production management are noted.
Tags: labour efficiency lean production production management system бережливое производство производительность труда система организации производства
CAD
Problems and solutions
On development of Russian academic science cooperation with business community and industrial and technological corporations for instrumentalization fund formation
The article provides information on the state of science in Russia and ways of its improvement based on campaign speech of A.Sergeev, the president of RAS. It analyses the personnel situation in Russian academic science and provides findings regarding measures for expanding and strengthening of RAS cooperation with business community and industrial and technological corporations.
Tags: russian academy of science science and technology policy научно-техническая политика российская академия наук
Microwave electronics
J.M.Greene, R.M.H.Smith, L.M.Devlin, R.Santhakumar, R.Martin, G.Cohn
L-band power amplifier based on GaN transistor The article considers the power amplifier based on QPD1013 Qorvo GaN transistor with particular focus on thermal issues, which are important when using high-power GaN transistors
in surface-mount packages.
L-band power amplifier based on GaN transistor The article considers the power amplifier based on QPD1013 Qorvo GaN transistor with particular focus on thermal issues, which are important when using high-power GaN transistors
in surface-mount packages.
Tags: gan transistor gan-транзистор power amplifier thermal conditions тепловой режим усилитель мощности
Industrial Electronics
P.Galagan, L.Kuzminsky, A.Sorokin
Computer vision problem solving based on GRIFON heterogeneous platform The article considers the organization of an effective machine vision system using parallel-pipeline data processing. As an example, the information on real time high-resolution video processing system based on GRIFON heterogeneous computing platform is presented.
Computer vision problem solving based on GRIFON heterogeneous platform The article considers the organization of an effective machine vision system using parallel-pipeline data processing. As an example, the information on real time high-resolution video processing system based on GRIFON heterogeneous computing platform is presented.
Tags: computer vision grifon platform heterogeneous computing system machine vision parallel computing video stream processing гетерогенная вычислительная система компьютерное зрение машинное зрение обработка видеопотоков параллельные вычисления платформа грифон
Displays
V.Ezhov
Mitsubishi electric TFT-LCD modules for industrial use The article covers the main categories of Mitsubishi Electric TFT-LCD modules for industrial use, proprietary technologies and key characteristics of new products presented by the company recently.
Mitsubishi electric TFT-LCD modules for industrial use The article covers the main categories of Mitsubishi Electric TFT-LCD modules for industrial use, proprietary technologies and key characteristics of new products presented by the company recently.
Tags: cover glass mitsubishi electric optical bonding projected capacitive touch panel tft-lcd module tft-lcd-модуль transflective display защитное стекло оптическая склейка проекционно-емкостная сенсорная панель трансфлективный дисплей
V.Belyaev
Advanced technologies at display week 2017 The regular Display Week was held on May 21–26, 2017 in Los Angeles (USA). The main topics of the Week were augmented and virtual reality (AR/VR), solutions for digital information boards, materials and processes for displays, portable displays.
Advanced technologies at display week 2017 The regular Display Week was held on May 21–26, 2017 in Los Angeles (USA). The main topics of the Week were augmented and virtual reality (AR/VR), solutions for digital information boards, materials and processes for displays, portable displays.
Tags: curved panels lcd and oled technologies oled wallpapers oled-обои transflective displays жк- и oled-технологии искривленные панели трансфлективные дисплеи
MCUs & MPUs
L. di Jasio
From PIC16F877 to PIC16F18877: twenty years of PIC microcontrollers evolution The article discusses key features and compares critical characteristics of different generations of Microchip’s PIC microcontrollers. Particular attention is paid to new solutions implemented in the latest generation of these chips PIC16F18877.
From PIC16F877 to PIC16F18877: twenty years of PIC microcontrollers evolution The article discusses key features and compares critical characteristics of different generations of Microchip’s PIC microcontrollers. Particular attention is paid to new solutions implemented in the latest generation of these chips PIC16F18877.
Tags: backward compatibility core independent peripherals microchip pic microcontrollers pic-микроконтроллеры независимая от ядра периферия совместимость с предыдущими моделями
Topic of the Year: Internet of Things
Key aspects of internet of things PCB design
Developing of high-quality PCBs for Internet of things products requires the use of an integrated design environment with enhanced functionality. The article discusses the key aspects that should be considered when designing IoT device PCBs.
Tags: integrated design environment internet of things layout constraint management mentor graphics pads pre- and post-layout simulation verification xpedition верификация интегрированная среда проектирования интернет вещей пред- и посттопологическое моделирование управление ограничениями топологии
LEDs Light Technology
M.Chervinsky
New NX LEDS from CREE. NX LED assemblies applications Under conditions of competitive and fast growing market of LED lighting manufacturers are forced to constantly improve the performance of luminaires and update the lineup. In 2017 CREE announced a new NX LED technology platform which continues the trend of increasing light flux density and improving LED performance.
New NX LEDS from CREE. NX LED assemblies applications Under conditions of competitive and fast growing market of LED lighting manufacturers are forced to constantly improve the performance of luminaires and update the lineup. In 2017 CREE announced a new NX LED technology platform which continues the trend of increasing light flux density and improving LED performance.