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Economy & Business
M. Makushin
Mergers/acquisitions wave in microelectronics: causes and consequences The article considers the features of latest mergers / acquisitions cycle of microelectronic companies (2015–2017): fast and wavy growth of production volumes; reduction in the number of largest suppliers in the key market segments; multiple transactions.
Mergers/acquisitions wave in microelectronics: causes and consequences The article considers the features of latest mergers / acquisitions cycle of microelectronic companies (2015–2017): fast and wavy growth of production volumes; reduction in the number of largest suppliers in the key market segments; multiple transactions.
Tags: acquisitions mergers structure and dynamics of mergers / acquisitions transactions сделки поглощения сделки слияния структура и динамика сделок слияний / поглощений
CAD
A. Akulin
Simulation and advanced circuit analysis in PSpice 2017 Part 2 The article considers the features of new version of PSpice analog/analog-digital circuit simulator from Cadence with PSpice Advanced Analysis option.
Simulation and advanced circuit analysis in PSpice 2017 Part 2 The article considers the features of new version of PSpice analog/analog-digital circuit simulator from Cadence with PSpice Advanced Analysis option.
Tags: advanced analysis cadence modeling monte carlo analysis optimizer orcad parametric sweep pspice pspice advanced analysis sensitivity smoke анализ monte carlo моделирование расширенный анализ
Test & Measurements
V. Belov, V. Petrov
Configuring the emc test laboratory with an open architecture The article considers the principles of construction and features of EMC compliance open architecture test laboratory by the example of EMC laboratory project for Innovation Design Center of Technopark-Mordovia.
Configuring the emc test laboratory with an open architecture The article considers the principles of construction and features of EMC compliance open architecture test laboratory by the example of EMC laboratory project for Innovation Design Center of Technopark-Mordovia.
Tags: electromagnetic compatibility interoperability modularity open architecture laboratories platform independence scalability tests интероперабельность испытания лаборатории с открытой архитектурой масштабируемость модульность платформенная независимость электромагнитная совместимость
N. Bogachev, S. Andreev, V. Dyomin, N. Guseyn-zade, A. Kirillov, O. Kalinin, A. Filippov
Plasma asymmetrical dipole antenna: the measurement of signal characteristics The article considers the measurement of the spectrum of frequency-modulated signals emitted by a plasma asymmetrical dipole antenna (PADA) as well as a similar metal asymmetrical dipole antenna (MADA). It is noted that the modulated signal emitted by PADA is not inferior in quality as a whole to the signal from MADA and even exceeds it by some parameters.
Plasma asymmetrical dipole antenna: the measurement of signal characteristics The article considers the measurement of the spectrum of frequency-modulated signals emitted by a plasma asymmetrical dipole antenna (PADA) as well as a similar metal asymmetrical dipole antenna (MADA). It is noted that the modulated signal emitted by PADA is not inferior in quality as a whole to the signal from MADA and even exceeds it by some parameters.
Tags: frequency-modulated signal plasma antenna signal analyzer анализатор сигналов плазменная антенна частотно-модулированный сигнал
G. Kuznetsov, V. Pribora, A. Frolov
Quality control of coatings using X-ray fluorescence analysis The article examines the quality control of coatings by means of X-ray fluorescence analysis using energy dispersive spectrometers (EDS). It is noted that EDSs enable to perform automated control of quality (thickness) of single-layer as well as multilayer coatings with the thickness from a few tens of microns to tens of nanometers across the sample surface. It is important for increasing the efficiency of present-day production facilities.
Quality control of coatings using X-ray fluorescence analysis The article examines the quality control of coatings by means of X-ray fluorescence analysis using energy dispersive spectrometers (EDS). It is noted that EDSs enable to perform automated control of quality (thickness) of single-layer as well as multilayer coatings with the thickness from a few tens of microns to tens of nanometers across the sample surface. It is important for increasing the efficiency of present-day production facilities.
Tags: coating thickness energy dispersive spectrometer x-ray fluorescence analysis рентгенофлуоресцентный анализ толщина покрытия энергодисперсионный спектрометр
Microprocessors and Computing Technology
S. Landyshev, M. Klimenko
1879vya1ya VLSI. Pseudo-noise signal processing The article considers the pseudo-noise signal processing in 1879VYa1Ya VLSI. Various methods of processing are analyzed. The estimation of the productivity of these methods and recommendations for their use are given.
1879vya1ya VLSI. Pseudo-noise signal processing The article considers the pseudo-noise signal processing in 1879VYa1Ya VLSI. Various methods of processing are analyzed. The estimation of the productivity of these methods and recommendations for their use are given.
Tags: fast convolution matched filter pseudo-noise signals быстрая свертка согласованный фильтр шумоподобные сигналы
Microwave electronics
V. Kochemasov, A. Kirpichenkov
Solid-state microwave switches Part 2 The article reviews the modular microwave switches of various types. The information on the parameters and features of the switches produced by a number of manufacturers have been observed.
Solid-state microwave switches Part 2 The article reviews the modular microwave switches of various types. The information on the parameters and features of the switches produced by a number of manufacturers have been observed.
Tags: insertion loss microwave switch switching time вносимые потери время переключения свч-переключатель
Microprocessors and FPGAs
J. Wilson
Feature-rich and flexible next-generation I/O controllers for industrial and embedded computing designs The article considers the latest generation of Microchip’s SCH322X Super I/O controllers family featuring an extended set of functions, small size packages and long life cycle.
Feature-rich and flexible next-generation I/O controllers for industrial and embedded computing designs The article considers the latest generation of Microchip’s SCH322X Super I/O controllers family featuring an extended set of functions, small size packages and long life cycle.
Tags: i/o controller lpc bus lpc-шина microchip parallel port sch322x super i/o family serial port контроллер ввода-вывода параллельный порт последовательный порт семейство sch322x super i/o
Digital manufacturing
M. Malov, D. Tulpa
From box solutions to system integration or what could be made from a simple sewing machine SWR group has augmented SolidWorks Enterprise PDM system in accordance with Russian standards. The article considers the additional software and solutions developed for this system.
From box solutions to system integration or what could be made from a simple sewing machine SWR group has augmented SolidWorks Enterprise PDM system in accordance with Russian standards. The article considers the additional software and solutions developed for this system.
Tags: plm/pdm solidworks enterprise pdm swr-archive swr-classifier swr-materials swr-resources swr-specification editor swr-архив swr-классификатор swr-материалы swr-редактор спецификаций swr-ресурсы
Digital economy
L. Ratkin
To the 75th anniversary of NRC Kurchatov institute: supercomputer technologies for digital economy and Industry 4.0 Based on the information presented at Russian Supercomputing Days 2017 conference the article describes the examples of the use of supercomputing in the development of products as well as its prospects in the context of digital economy creation. It underlines a number of relevant objectives on the formation of conditions for the development of digital economy and implementation of Industry 4.0 concept.
To the 75th anniversary of NRC Kurchatov institute: supercomputer technologies for digital economy and Industry 4.0 Based on the information presented at Russian Supercomputing Days 2017 conference the article describes the examples of the use of supercomputing in the development of products as well as its prospects in the context of digital economy creation. It underlines a number of relevant objectives on the formation of conditions for the development of digital economy and implementation of Industry 4.0 concept.
Tags: automated control systems for industries and regions digital economy industry 4.0 product life cycle management simulation of technical objects supercomputing автоматизированные системы управления отраслей и регионов «индустрия 4.0» моделирование технических объектов суперкомпьютерные вычисления управление жизненным циклом изделия цифровая экономика
Electromechanical components
M. Samoylova
Reliable ODU contacts are an answer to everything! The reliability of electronic device directly depends on the quality of connectors, primarily on the contacts used in them. The article considers all of the types of ODU electrical contacts including novelties. Some variants of their application are given.
Reliable ODU contacts are an answer to everything! The reliability of electronic device directly depends on the quality of connectors, primarily on the contacts used in them. The article considers all of the types of ODU electrical contacts including novelties. Some variants of their application are given.
Production technologies
S. Vantsov, Z. Maung Maung
Quasi-deterministic model of thermal effects when producing the holes in printed circuit boards The results of experimental studies described in the article allow at the technological preparation stage to simulate the process of component holes and vias production in printed circuit boards taking into account the random nature of drill heating in the process of cutting.
Quasi-deterministic model of thermal effects when producing the holes in printed circuit boards The results of experimental studies described in the article allow at the technological preparation stage to simulate the process of component holes and vias production in printed circuit boards taking into account the random nature of drill heating in the process of cutting.