We see that we can speak with foreign companies on equal terms DOI: 10.22184/1992-4178.2019.190.9.10.16
It's time to move to Russian technology. Especially when there is one DOI: 10.22184/1992-4178.2019.190.9.44.52
Visit to St. Petersburg’s Center ELMA LLC
Flexibility or productivity of contract manufacturing: is the dilemma solvable? DOI: 10.22184/1992-4178.2019.190.9.54.63
Visit to Nanotech LLC assembly site
Conference "State support of export activities of radio-electronic industry enterprises" DOI: 10.22184/1992-4178.2019.190.9.36.39
Microelectronic Assembly and Packaging Technologies DOI: 10.22184/1992-4178.2019.190.9.42.43
III annual technology conference “Technologies of
microelectronic assembly and packaging” by Global
Engineering GC
Universal assembly centers: how to accelerate the market launch of complex and unique products DOI: 10.22184/1992-4178.2019.190.9.66.69
Mastering EUV lithography in serial production: prospects and problems DOI: 10.22184/1992-4178.2019.190.9.70.79
Image generators for maskless lithography DOI: 10.22184/1992-4178.2019.190.9.80.84
Water-proof coating: what to consider when choosing one DOI: 10.22184/1992-4178.2019.190.9.86.88
Time domain simulation of linear Hall sensors and experimental identification of their models parameters using Rohde & Schwarz equipment DOI: 10.22184/1992-4178.2019.190.9.104.113
Development and manufacture of microassemblies based on multilayer ceramics DOI: 10.22184/1992-4178.2019.190.9.90.93
Medium and High Power microwave Solid-State Switches. Part 2 DOI: 10.22184/1992-4178.2019.190.9.116.130
The use of accelerated methods for assessing the reliability indicators of domestic electronic components is one of the ways to increase their commercial attractiveness DOI: 10.22184/1992-4178.2019.190.9.136.140
Shielded and anechoic chambers for confidential information protection and EMC testing DOI: 10.22184/1992-4178.2019.190.9.142.147
HARTING digital technology for modern production: when a customer becomes a partner DOI: 10.22184/1992-4178.2019.190.9.132.135
Development of electrochemical capacitor electrodes based on silicon-carbon structures DOI: 10.22184/1992-4178.2019.190.9.96.102