rus
Competent opinion
S. Legostaeva
For Development of Domestic Computing Equipment, We Must Join Efforts DOI: 10.22184/1992-4178.2020.197.6.12.18
For Development of Domestic Computing Equipment, We Must Join Efforts DOI: 10.22184/1992-4178.2020.197.6.12.18
Column of radio-electronic industry department
Company Profile
Half a century of experience and achievements: TECHNOTECH’s production facility celebrates its 50th anniversary
DOI: 10.22184/1992-4178.2020.197.6.32.34
NEWS
Economy & Business
I. Pokrovsky
How to Change from Struggle for Dominance to Cooperative Development DOI: 10.22184/1992-4178.2020.197.6.134.139
The article discusses the use of digital platforms by companies as a tool to achieve market dominance as well as the associated negative factors for further technological and economic development. It adduces an option to oppose the technological and economic dependence on global corporations and describes the basic ideas of this option.
How to Change from Struggle for Dominance to Cooperative Development DOI: 10.22184/1992-4178.2020.197.6.134.139
The article discusses the use of digital platforms by companies as a tool to achieve market dominance as well as the associated negative factors for further technological and economic development. It adduces an option to oppose the technological and economic dependence on global corporations and describes the basic ideas of this option.
Tags: digital platforms global corporations monopolization technological and economic dependence technological platforms vendor independence вендеронезависимость глобальные корпорации монополизация технологическая и экономическая зависимость технологические платформы цифровые платформы
Manufacturing equipment and process materials
V. Andriyanov, S. Sidelnikov, S. Goryachkin
Seed rotary and movement drive for Czochralski silicon monocrystals growth setup DOI: 10.22184/1992-4178.2020.197.6.110.112
The article considers the design of seed rotation and movement drive for the installations for growing silicon monocrystals by Czochralski method. It is noted that the drive features are the use of cylindrical differential in the kinematics and the use of a chain as a flexible suspension.
Seed rotary and movement drive for Czochralski silicon monocrystals growth setup DOI: 10.22184/1992-4178.2020.197.6.110.112
The article considers the design of seed rotation and movement drive for the installations for growing silicon monocrystals by Czochralski method. It is noted that the drive features are the use of cylindrical differential in the kinematics and the use of a chain as a flexible suspension.
Tags: czochralski method drive monocrystalline silicon seed затравка метод чохральского монокристаллический кремний привод
Electronic Components
E. Pavlyukovich
GSI Technology’s random access memory: record performance and high reliability DOI: 10.22184/1992-4178.2020.197.6.80.85
GSI Technology specializes in the development of high performance static random access memory (RAM) and is the world’s leading company in this field. The article provides basic information about the company and its products.
GSI Technology’s random access memory: record performance and high reliability DOI: 10.22184/1992-4178.2020.197.6.80.85
GSI Technology specializes in the development of high performance static random access memory (RAM) and is the world’s leading company in this field. The article provides basic information about the company and its products.
Tags: data bandwidth gsi technology ip controller ip‑контроллер neural network detector for artificial intelligence radiation-hardened chip read latency static random access memory transaction rate задержка чтения нейросетевой детектор для искусственного интеллекта полоса пропускания радиационно-стойкая микросхема скорость доступа статическая оперативная память
A. Kotyukov, A. Nikonov, A. Zaslavsky, Yu. Ivanov
Specific features of the application of crystal oscillators with high temperature stability DOI: 10.22184/1992-4178.2020.197.6.86.89
The article discusses the operational features of temperature compensated crystal oscillators, methods for measuring temperature stability as well as the influence of other factors on it.
Specific features of the application of crystal oscillators with high temperature stability DOI: 10.22184/1992-4178.2020.197.6.86.89
The article discusses the operational features of temperature compensated crystal oscillators, methods for measuring temperature stability as well as the influence of other factors on it.
Tags: temperature compensated crystal oscillators temperature stability температурная стабильность термостатированные кварцевые генераторы
Test & Measurements
Makhasin Fra, V. Belyaev, I. Leonisova
Electromagnetic pollution from radio frequency sources and their effects on humans DOI: 10.22184/1992-4178.2020.197.6.70.74
The article considers the intensity of electromagnetic radiation in various frequency ranges, its possible danger to humans and animals.
Electromagnetic pollution from radio frequency sources and their effects on humans DOI: 10.22184/1992-4178.2020.197.6.70.74
The article considers the intensity of electromagnetic radiation in various frequency ranges, its possible danger to humans and animals.
Tags: maximum exposure level sources of em radiation источники эм‑излучения предельный уровень облучения
A. Ivanov
Current status of implementing the boundary scan in Russian electronic components DOI: 10.22184/1992-4178.2020.197.6.76.78
The article provides an overview of supporting the IEEE 1149.1 boundary scan standard by Russian electronic components. The problems and obstacles are considered, which slow down implementing the standard as well as possible solutions.
Current status of implementing the boundary scan in Russian electronic components DOI: 10.22184/1992-4178.2020.197.6.76.78
The article provides an overview of supporting the IEEE 1149.1 boundary scan standard by Russian electronic components. The problems and obstacles are considered, which slow down implementing the standard as well as possible solutions.
Tags: assembled pcb testing boundary scan digital electronic components russian electronic components периферийное сканирование российская экб тестирование собранных печатных плат цифровая экб
Micromodules and microassemblies
D. Vertyanov, S. Evstafiev, P. Viklund, V. Sidorenko
Unpackaged element’s internal mounting technologies and design aspects for microsystems with embedded chips. Part 1 DOI: 10.22184/1992-4178.2020.197.6.96.102
The article provides an overview of technologies and design and technological solutions for internal mounting the elements in package and PCB substrate structure, discusses the problems and ways of solving them when implementing a project with embedded active and passive components using Mentor, A Siemens Business CAD system.
Unpackaged element’s internal mounting technologies and design aspects for microsystems with embedded chips. Part 1 DOI: 10.22184/1992-4178.2020.197.6.96.102
The article provides an overview of technologies and design and technological solutions for internal mounting the elements in package and PCB substrate structure, discusses the problems and ways of solving them when implementing a project with embedded active and passive components using Mentor, A Siemens Business CAD system.
Tags: adhesive chip first technology chip last technology embedded component internal mounting technology laminate laser processing metal foil prepreg substrate unpackaged element адгезив бескорпусной элемент встроенный компонент лазерная обработка ламинат металлическая фольга подложка препрег технология chip first технология chip last технология внутреннего монтажа
Microwave electronics
V. Gevorkyan, V. Kochemasov
Ferrite Switches. Part 1 DOI: 10.22184/1992-4178.2020.197.6.90.94
he article considers ferrite switches. Information on design principles, options and characteristics of these devices is provided.
Ferrite Switches. Part 1 DOI: 10.22184/1992-4178.2020.197.6.90.94
he article considers ferrite switches. Information on design principles, options and characteristics of these devices is provided.
Tags: ferrite switches insertion loss isolation switching time вносимые потери время переключения развязка ферритовые переключатели
Reliability and tests
P. Lysenko
MS Certification against GOST R ISO 9001-2015: Why Is It Needed? DOI: 10.22184/1992-4178.2020.197.6.36.37
MS Certification against GOST R ISO 9001-2015: Why Is It Needed? DOI: 10.22184/1992-4178.2020.197.6.36.37
A. Petrovichev
Avionic equipment direct lightning strike testing DOI: 10.22184/1992-4178.2020.197.6.38.40
Using the example of section 23.0 of KT‑160G / 14G qualification requirements for aviation the article considers the procedure for direct lightning strike testing, requirements for equipment and methods of evaluating the results, as well as possible problems and ways of solving them during testing.
Avionic equipment direct lightning strike testing DOI: 10.22184/1992-4178.2020.197.6.38.40
Using the example of section 23.0 of KT‑160G / 14G qualification requirements for aviation the article considers the procedure for direct lightning strike testing, requirements for equipment and methods of evaluating the results, as well as possible problems and ways of solving them during testing.
Tags: aircraft direct lightning strike resistance test high current impact high-voltage discharge kt‑160g / 14g qualification requirements test pulse generator воздействие сильным током высоковольтный разряд генератор испытательных импульсов испытания на стойкость к прямому удару молнии квалификационные требования кт‑160g / 14g летательный аппарат
A. Chiminyov
PCB is a Key Component Determining End-Product Reliability DOI: 10.22184/1992-4178.2020.197.6.42.46
The article discusses a number of factors which determine PCB reliability related to design, materials, manufacturing process, verification and tests, and the requirements for the PCB. It lists certain aspects of IPC standards requirements for PCBs on the basis of product class as well as different and additional requirements of NCAB.
PCB is a Key Component Determining End-Product Reliability DOI: 10.22184/1992-4178.2020.197.6.42.46
The article discusses a number of factors which determine PCB reliability related to design, materials, manufacturing process, verification and tests, and the requirements for the PCB. It lists certain aspects of IPC standards requirements for PCBs on the basis of product class as well as different and additional requirements of NCAB.
Tags: annular ring hal finish hole fill ipc standards microsection microvia ncab specification pcb reliability through hole barrel гарантийный поясок контактной площадки горячее лужение заполнение отверстий металлизация отверстий микропереходные отверстия микрошлиф надежность печатная плата спецификация ncab стандарты ipc
M. Perlman
2D Metrology – automatic 2D measurements for precise verifying the conductors with a given characteristic impedance DOI: 10.22184/1992-4178.2020.197.6.48.50
The article substantiates the need for total verifying high-frequency PCB lines impedance for digital electronics. The factors influencing the wave impedance of such lines are given. It describes Orbotech built-in AOI tool for fast and accurate measurements of conductor cross-sections during PCB inspection.
2D Metrology – automatic 2D measurements for precise verifying the conductors with a given characteristic impedance DOI: 10.22184/1992-4178.2020.197.6.48.50
The article substantiates the need for total verifying high-frequency PCB lines impedance for digital electronics. The factors influencing the wave impedance of such lines are given. It describes Orbotech built-in AOI tool for fast and accurate measurements of conductor cross-sections during PCB inspection.
Tags: aoi cross-section of printed conductors fast measurement high-frequency electronics impedance measuring long lines аои быстрое измерение высокочастотная электроника длинные линии контроль импеданса поперечное сечение печатных проводников
I. Vasiliev
Features of measuring the resistivity and surface resistance by four-point probe method DOI: 10.22184/1992-4178.2020.197.6.52.58
The article provides an overview of modern methods for measuring resistivity and surface resistance, describes their strengths and weaknesses as well as possible ways to eliminate these limitations. As a ready-made solution manual and automatic software and hardware systems are presented, which are able to solve various production tasks when measuring electrophysical parameters.
Features of measuring the resistivity and surface resistance by four-point probe method DOI: 10.22184/1992-4178.2020.197.6.52.58
The article provides an overview of modern methods for measuring resistivity and surface resistance, describes their strengths and weaknesses as well as possible ways to eliminate these limitations. As a ready-made solution manual and automatic software and hardware systems are presented, which are able to solve various production tasks when measuring electrophysical parameters.
Tags: four-point probe method resistivity surface resistance поверхностное сопротивление удельное сопротивление четырехзондовый метод
for Engineers
Electronics for Civil Use
A. Ukhov, V. Gerasimov, L. Selivanov, V. Simon
Improving the security and reliability of smart locks DOI: 10.22184/1992-4178.2020.197.6.60.63
The article considers the general principles of smart locks with wireless communication. A new design of a smart lock with two communication channels is proposed and its energy consumption is calculated. The advantage of using an additional communication channel to improve the security and reliability of a smart lock is proved.
Improving the security and reliability of smart locks DOI: 10.22184/1992-4178.2020.197.6.60.63
The article considers the general principles of smart locks with wireless communication. A new design of a smart lock with two communication channels is proposed and its energy consumption is calculated. The advantage of using an additional communication channel to improve the security and reliability of a smart lock is proved.
Tags: bluetooth low energy (ble) security smart lock wireless communication безопасность беспроводная связь умный замок
Internet of Things
J. Tollefson
Hello... Are You There? How to prevent dropped communication in critical IoT applications DOI: 10.22184/1992-4178.2020.197.6.64.66
Hello... Are You There? How to prevent dropped communication in critical IoT applications DOI: 10.22184/1992-4178.2020.197.6.64.66
Automobile Electronics
D. McGrath
Designing 5G wireless chipsets for self-driving cars The article discusses the issues related to the design of 5G wireless chipsets for self-driving cars. It is noted that the control and measurement solutions used to test such chipsets must accurately measure and evaluate the signal characteristics without creating new issues.
Designing 5G wireless chipsets for self-driving cars The article discusses the issues related to the design of 5G wireless chipsets for self-driving cars. It is noted that the control and measurement solutions used to test such chipsets must accurately measure and evaluate the signal characteristics without creating new issues.
Tags: 5g technologies self-driving cars wireless chipsets беспилотные автомобили беспроводные чипсеты технологии 5g
Production technologies
N. Kulchitsky, A. Naumov, V. Startsev
Cooled IR photodetectors based on cadmium-mercury- tellurium: current status and development prospects DOI: 10.22184/1992-4178.2020.197.6.114.121
The article analyzes the market status and development prospects of cooled IR photodetectors based on cadmium-mercury-tellurium.
Cooled IR photodetectors based on cadmium-mercury- tellurium: current status and development prospects DOI: 10.22184/1992-4178.2020.197.6.114.121
The article analyzes the market status and development prospects of cooled IR photodetectors based on cadmium-mercury-tellurium.
Tags: bridgman method cadmium-mercury-tellurium epitaxy photodetector arrays r detectors ик‑детекторы кадмий-ртуть-теллур матричные фпу метод бриджмена эпитаксия
N. Tolochko, V. Lanin
3D printing in electronics DOI: 10.22184/1992-4178.2020.197.6.124.132
The article considers the types of 3D printing technologies used in electronics. The features of the application of these technologies for the creation of various electronic devices and their components are discussed. Particular attention is paid to the use of multi-material and hybrid 3D printing technologies in embedded, conformal and flexible electronics.
3D printing in electronics DOI: 10.22184/1992-4178.2020.197.6.124.132
The article considers the types of 3D printing technologies used in electronics. The features of the application of these technologies for the creation of various electronic devices and their components are discussed. Particular attention is paid to the use of multi-material and hybrid 3D printing technologies in embedded, conformal and flexible electronics.
Tags: 3d printing technologies conformal and flexible electronics electronic devices embedded встроенная конформная и гибкая электроника технологии 3d‑печати электронные устройства
Micro and nanostructures
A. Kamysheva
Comparative analysis of current-voltage characteristics of ion-selective field-effect transistors with membranes based on tantalum, niobium and titanium oxides DOI: 10.22184/1992-4178.2020.197.6.106.108
As part of a study to create a prototype of a sensitive element for water pollution sensors a comparative analysis of the current-voltage characteristics of ion-selective field-effect transistors with membranes based on niobium, tantalum and titanium was made. It has been found that these transistors give the same response to hydrogen ions.
Comparative analysis of current-voltage characteristics of ion-selective field-effect transistors with membranes based on tantalum, niobium and titanium oxides DOI: 10.22184/1992-4178.2020.197.6.106.108
As part of a study to create a prototype of a sensitive element for water pollution sensors a comparative analysis of the current-voltage characteristics of ion-selective field-effect transistors with membranes based on niobium, tantalum and titanium was made. It has been found that these transistors give the same response to hydrogen ions.
Tags: current-voltage characteristics gate isolator ion-selective field-effect transistors membranes oxides of niobium tantalum and titanium water pollution sensors вольт-амперные характеристики датчики загрязнения воды ионоселективные полевые транзисторы мембраны оксиды ниобия подзатворный диэлектрик тантала и титана