rus
Competent opinion
V. Vasilevskaya
SCIENTIFIC RESEARCH MUST END IN PRACTICAL RESULTS DOI: 10.22184/1992-4178.2021.210.9.12.18
SCIENTIFIC RESEARCH MUST END IN PRACTICAL RESULTS DOI: 10.22184/1992-4178.2021.210.9.12.18
Exhibitions & Conferences
Yu. Kovalevsky
TESTING OF ELECTRONIC ASSEMBLIES: FRESH AND UNCOMMON THINGS JTAG TECHNOLOGIES BOUNDARY SCAN AND SPEA IN-CIRCUIT TESTING SYSTEMS USER CONFERENCE DOI: 10.22184/1992-4178.2021.210.9.48.50
TESTING OF ELECTRONIC ASSEMBLIES: FRESH AND UNCOMMON THINGS JTAG TECHNOLOGIES BOUNDARY SCAN AND SPEA IN-CIRCUIT TESTING SYSTEMS USER CONFERENCE DOI: 10.22184/1992-4178.2021.210.9.48.50
Yu. Kovalevsky
NOT ONLY QUALITY, BUT ALSO PRODUCTION VOLUMES “ECB-2021” THE 10TH ALL-RUSSIA SCIENCE AND TECHNOLOGY CONFERENCE DOI: 10.22184/1992-4178.2021.210.9.52.55
NOT ONLY QUALITY, BUT ALSO PRODUCTION VOLUMES “ECB-2021” THE 10TH ALL-RUSSIA SCIENCE AND TECHNOLOGY CONFERENCE DOI: 10.22184/1992-4178.2021.210.9.52.55
Event of Issue
Yu. Kovalevsky
NEW SUPPORTING MEASURES, THE FIRST END-TO-END PROJECTS, AND THE FUTURE OF SEMICONDUCTOR TECHNOLOGIES IN RUSSIA PLENARY SESSIONS OF THE 7TH “MICROELECTRONICS 2021” FORUM FOR INDUSTRY DEVELOPMENT STRATEGY AND COMPETITIVE ABILITY OF RUSSIAN ELECTRONIC COMP DOI: 10.22184/1992-4178.2021.210.9.36.46
NEW SUPPORTING MEASURES, THE FIRST END-TO-END PROJECTS, AND THE FUTURE OF SEMICONDUCTOR TECHNOLOGIES IN RUSSIA PLENARY SESSIONS OF THE 7TH “MICROELECTRONICS 2021” FORUM FOR INDUSTRY DEVELOPMENT STRATEGY AND COMPETITIVE ABILITY OF RUSSIAN ELECTRONIC COMP DOI: 10.22184/1992-4178.2021.210.9.36.46
NEWS
Success Story
FANTASTIC TECHNOLOGY FOR THOSE WHO DON’T BELIEVE IN FAIRY TALES
DOI: 10.22184/1992-4178.2021.210.9.56.60
Economy & Business
A. Brykin, M. Makushin
MICROELECTRONICS AND STATE POLICY OF HIGH-TECH COUNTRIES: NATIONALIZATION INSTEAD OF GLOBALIZATION DOI: 10.22184/1992-4178.2021.210.9.148.156
Globalization is largely the result of a unipolar world order. The two largest economies in the world, the United States and China, are striving to create closed and self-sufficient ecosystems within the framework of microelectronics and related high-tech industries.
MICROELECTRONICS AND STATE POLICY OF HIGH-TECH COUNTRIES: NATIONALIZATION INSTEAD OF GLOBALIZATION DOI: 10.22184/1992-4178.2021.210.9.148.156
Globalization is largely the result of a unipolar world order. The two largest economies in the world, the United States and China, are striving to create closed and self-sufficient ecosystems within the framework of microelectronics and related high-tech industries.
Tags: closed ecosystem contract manufacturing export control government support nationalization sanctions государственная поддержка замкнутая экосистема контрактные производства национализация санкции экспортный контроль
Manufacturing equipment and process materials
I. Konyashov
AUTOMATIC WAREHOUSE SYSTEM BASED ON SCIENSCOPE COMPONENT COUNTERS AND YAMAHA INTELLIGENT STORAGE SYSTEMS DOI: 10.22184/1992-4178.2021.210.9.62.66
The article presents the automatic warehouse system based on ScienScope and Yamaha equipment, AXC-800 III series X-ray component counters and YST15 automated component storage system. The equipment is supplied by ASSEMRUS.
AUTOMATIC WAREHOUSE SYSTEM BASED ON SCIENSCOPE COMPONENT COUNTERS AND YAMAHA INTELLIGENT STORAGE SYSTEMS DOI: 10.22184/1992-4178.2021.210.9.62.66
The article presents the automatic warehouse system based on ScienScope and Yamaha equipment, AXC-800 III series X-ray component counters and YST15 automated component storage system. The equipment is supplied by ASSEMRUS.
Tags: automatic warehouse system component counters component flow control автоматическая складская система счетчики компонентов управление потоками компонентов
CAD
K. Felton, D. Vertyanov, S. Evstafiev, V. Sidorenko
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS DOI: 10.22184/1992-4178.2021.210.9.142.146
The article discusses new IC packaging solution, the digital twin concept. This is an electronic virtual model of a product being developed, which allows for integrated codesign at every stage of its development.
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS DOI: 10.22184/1992-4178.2021.210.9.142.146
The article discusses new IC packaging solution, the digital twin concept. This is an electronic virtual model of a product being developed, which allows for integrated codesign at every stage of its development.
Test & Measurements
A. Menderov
COMPARISON OF FUNCTION AND ARBITRARY WAVEFORM GENERATORS DOI: 10.22184/1992-4178.2021.210.9.122.125
A comparison is made between functional generators and arbitrary waveform generators. The article provides information on the advantages, disadvantages and applications of these generators.
COMPARISON OF FUNCTION AND ARBITRARY WAVEFORM GENERATORS DOI: 10.22184/1992-4178.2021.210.9.122.125
A comparison is made between functional generators and arbitrary waveform generators. The article provides information on the advantages, disadvantages and applications of these generators.
Tags: arbitrary waveform generator functional signal generator testing генераторов сигналов произвольной формы тестирование функциональный генератор сигналов
Circuit Technique
А. Voronin
TIME MEASUREMENT AND CLOCK FREQUENCIES GENERATION IN READOUT ELECTRONICS FOR SILICON DETECTORS DOI: 10.22184/1992-4178.2021.210.9.106.120
The article discusses the main methods of time stamps formation, methods of time measurement errors compensation, solutions for clock frequencies generation in the readout electronics of silicon detectors for experiments in the field of high-energy physics and physics of cosmic rays.
TIME MEASUREMENT AND CLOCK FREQUENCIES GENERATION IN READOUT ELECTRONICS FOR SILICON DETECTORS DOI: 10.22184/1992-4178.2021.210.9.106.120
The article discusses the main methods of time stamps formation, methods of time measurement errors compensation, solutions for clock frequencies generation in the readout electronics of silicon detectors for experiments in the field of high-energy physics and physics of cosmic rays.
Tags: clock generation pll readout electronics silicon detector time measurement error time stamp кремниевый детектор метка времени погрешность измерения времени считывающая электроника фапч формирование тактовой частоты
Reliability and tests
A. Ivanov, D. Nikishin
XILINX VIRTEX-7 CHIPS INSPECTION TEST USING BOUNDARY SCAN DOI: 10.22184/1992-4178.2021.210.9.94.98
The article considers the use of boundary scan for the inspection test of Xilinx Virtex-7 chips. It is noted that the presented solutions can be used at the enterprises of the radio-electronic industry to carry out the incoming verification procedure.
XILINX VIRTEX-7 CHIPS INSPECTION TEST USING BOUNDARY SCAN DOI: 10.22184/1992-4178.2021.210.9.94.98
The article considers the use of boundary scan for the inspection test of Xilinx Virtex-7 chips. It is noted that the presented solutions can be used at the enterprises of the radio-electronic industry to carry out the incoming verification procedure.
V. Voronin
APPLICATION OF SPEA 4060 FOR INCOMING INSPECTION OF PRINTED CIRCUIT BOARDS DOI: 10.22184/1992-4178.2021.210.9.100.103
The article describes the case study of using SPEA 4060 automatic flying probe tester at NPO PKRV JSC production facility, which is capable of testing printed modules in the context of both large-scale and multi-product medium or small-scale production.
APPLICATION OF SPEA 4060 FOR INCOMING INSPECTION OF PRINTED CIRCUIT BOARDS DOI: 10.22184/1992-4178.2021.210.9.100.103
The article describes the case study of using SPEA 4060 automatic flying probe tester at NPO PKRV JSC production facility, which is capable of testing printed modules in the context of both large-scale and multi-product medium or small-scale production.
Tags: electrical circuits integrity flying probe tester incoming inspection manufacturing defects printed circuit board signal layer test task входной контроль печатная плата производственный брак сигнальный слой тестовое задание установка электрического контроля с летающими пробниками целостность электрических цепей
A. Bedareva
IPC STANDARDS: SIGNIFICANCE OF THEIR APPLYING IN PRODUCTION PROCESSES DOI: 10.22184/1992-4178.2021.210.9.104.105
"LionTech" offers training in the organization of production processes according to IPC standards. Training is provided by IPC certified trainers. Every training participant obtains an international specialist certificate registered with the IPC association.
IPC STANDARDS: SIGNIFICANCE OF THEIR APPLYING IN PRODUCTION PROCESSES DOI: 10.22184/1992-4178.2021.210.9.104.105
"LionTech" offers training in the organization of production processes according to IPC standards. Training is provided by IPC certified trainers. Every training participant obtains an international specialist certificate registered with the IPC association.
Power electronics
F. Dostal
POWER SUPPLY DESIGN: MINI TUTORIAL DOI: 10.22184/1992-4178.2021.210.9.126.133
The article considers the basic and commonly used isolated and non-isolated power supply topologies, their advantages and disadvantages, as well as issues related to filtering and electromagnetic interference.
POWER SUPPLY DESIGN: MINI TUTORIAL DOI: 10.22184/1992-4178.2021.210.9.126.133
The article considers the basic and commonly used isolated and non-isolated power supply topologies, their advantages and disadvantages, as well as issues related to filtering and electromagnetic interference.
Tags: boost converter buck-boost converter buck converter ćuk flyback and forward converters isolated and non-isolated topologies isolation ldo regulator ldo-стабилизатор sepic switch-mode power supply zeta изолированная и неизолированная топологии импульсный источник питания обратноходовой и прямоходовой преобразователи повышающе-понижающий преобразователь повышающий преобразователь понижающий преобразователь развязка
V. Ezhov, E. Rabinovich
COMPACT AND HIGHLY EFFICIENT: THE NEW 600W MODULAR DC/DC CONVERTER FROM TDK-LAMBDA DOI: 10.22184/1992-4178.2021.210.9.136.140
TDK-Lambda recently released a new 600 W model in PH-A280 series of high voltage modular DC/DC converters, the industry's smallest solution in its class. The article discusses the main characteristics of PH-A280 series and the features of new device.
COMPACT AND HIGHLY EFFICIENT: THE NEW 600W MODULAR DC/DC CONVERTER FROM TDK-LAMBDA DOI: 10.22184/1992-4178.2021.210.9.136.140
TDK-Lambda recently released a new 600 W model in PH-A280 series of high voltage modular DC/DC converters, the industry's smallest solution in its class. The article discusses the main characteristics of PH-A280 series and the features of new device.
Tags: conductive cooling input voltage range isolated dc/dc converter load current modular power supply substrate temperature диапазон входных напряжений изолированный dс/dc-преобразователь кондуктивное охлаждение модульный источник питания температура подложки ток нагрузки
for Engineers
Production technologies
O. Vakhrushev
NEW LEASE OF LIFE OF WAVE SOLDERING TECHNOLOGY. Part 1 DOI: 10.22184/1992-4178.2021.210.9.70.78
The article provides general information about the equipment and processes of selective soldering and mass wave soldering, analyzes the reasons for the growing popularity of selective soldering, compares the selective soldering and mass wave soldering technologies in terms of performance and cost of ownership, suggests methods for eliminating the disadvantages of mass wave soldering.
NEW LEASE OF LIFE OF WAVE SOLDERING TECHNOLOGY. Part 1 DOI: 10.22184/1992-4178.2021.210.9.70.78
The article provides general information about the equipment and processes of selective soldering and mass wave soldering, analyzes the reasons for the growing popularity of selective soldering, compares the selective soldering and mass wave soldering technologies in terms of performance and cost of ownership, suggests methods for eliminating the disadvantages of mass wave soldering.
Tags: pcb assembling selective soldering through-hole technology wave soldering монтаж компонентов в отверстия пайка волной сборка печатных узлов селективная пайка
R. Akhmetgaliev, E. Ermolaev, Sh. Shugaepov
NEW OPPORTUNITIES OF PLANT OF SEMICONDUCTOR DEVICES JSC IN THE FIELD OF SINTERING CERAMIC MATERIALS DOI: 10.22184/1992-4178.2021.210.9.80.84
The article considers the equipment for sintering ceramic materials, introduced by Plant of semiconductor devices JSC. It is noted that the equipment capabilities made it possible to upgrade the technological process of sintering metal-ceramic products and create new types of products with high-density commutation wiring.
NEW OPPORTUNITIES OF PLANT OF SEMICONDUCTOR DEVICES JSC IN THE FIELD OF SINTERING CERAMIC MATERIALS DOI: 10.22184/1992-4178.2021.210.9.80.84
The article considers the equipment for sintering ceramic materials, introduced by Plant of semiconductor devices JSC. It is noted that the equipment capabilities made it possible to upgrade the technological process of sintering metal-ceramic products and create new types of products with high-density commutation wiring.
Tags: ceramic materials kilning metal-ceramic package sintering керамические материалы металлокерамический корпус обжиг спекание
D. Sukhanov
OPTIMIZATION OF GALVANIC PROCESSES IN MODERN SEMICONDUCTOR MANUFACTURING. Part 1 DOI: 10.22184/1992-4178.2021.210.9.86.93
The article reviews the galvanic processes used in modern semiconductor manufacturing. Information is provided on the basic principles and methods of optimizing such processes.
OPTIMIZATION OF GALVANIC PROCESSES IN MODERN SEMICONDUCTOR MANUFACTURING. Part 1 DOI: 10.22184/1992-4178.2021.210.9.86.93
The article reviews the galvanic processes used in modern semiconductor manufacturing. Information is provided on the basic principles and methods of optimizing such processes.