rus
Competent opinion
V. Melnikov
IN ORDER TO REMAIN A LEADER, ONE MUST СONTINUOUSLY GET BETTER DOI: 10.22184/1992-4178.2022.212.1.14.19
IN ORDER TO REMAIN A LEADER, ONE MUST СONTINUOUSLY GET BETTER DOI: 10.22184/1992-4178.2022.212.1.14.19
Column of radio-electronic industry department
Rules and Regulations
Yu. Kovalevsky
ENHANCEMENT OF LEGISLATION ON SUPPORT FOR DOMESTIC INDUSTRIAL PRODUCERS MEETING OF THE MILITARY AND INDUSTRIAL POLICY AND BUDGET SECTION OF THE EXPERT COUNCIL OF THE FEDERATION COUNCIL COMMITTEE ON DEFENSE AND SECURITY DOI: 10.22184/1992-4178.2022.212.1.34.36
ENHANCEMENT OF LEGISLATION ON SUPPORT FOR DOMESTIC INDUSTRIAL PRODUCERS MEETING OF THE MILITARY AND INDUSTRIAL POLICY AND BUDGET SECTION OF THE EXPERT COUNCIL OF THE FEDERATION COUNCIL COMMITTEE ON DEFENSE AND SECURITY DOI: 10.22184/1992-4178.2022.212.1.34.36
Exhibitions & Conferences
V. Mironyuk
JOINT SESSION OF ROSATOM'S COMPANIES AND INTERDEPARTMENTAL WORKING GROUP’S SECTION No. 9 OF THE BOARD OF MILITARY-INDUSTRIAL COMMISSION OF THE RUSSIAN FEDERATION DOI: 10.22184/1992-4178.2022.212.1.38.43
JOINT SESSION OF ROSATOM'S COMPANIES AND INTERDEPARTMENTAL WORKING GROUP’S SECTION No. 9 OF THE BOARD OF MILITARY-INDUSTRIAL COMMISSION OF THE RUSSIAN FEDERATION DOI: 10.22184/1992-4178.2022.212.1.38.43
R. Mangusheva
NEWS OF EXHIBITIONS AND “ELECTRONICA” AWARD DOI: 10.22184/1992-4178.2022.212.1.44.46
NEWS OF EXHIBITIONS AND “ELECTRONICA” AWARD DOI: 10.22184/1992-4178.2022.212.1.44.46
Yu. Kovalevsky
CONTRACT DESIGN IN RUSSIA: HOW IT DEVELOPS AND WHAT HINDERS IT “ELECTRONICS CONTRACT DESIGN” EDMA CONFERENCE DOI: 10.22184/1992-4178.2022.212.1.48.50
CONTRACT DESIGN IN RUSSIA: HOW IT DEVELOPS AND WHAT HINDERS IT “ELECTRONICS CONTRACT DESIGN” EDMA CONFERENCE DOI: 10.22184/1992-4178.2022.212.1.48.50
NEWS
Success Story
SMART FACTORY WHICH WORKS
DOI: 10.22184/1992-4178.2022.212.1.52.57
Economy & Business
M. Makushin
IC CONTRACT MANUFACTURING: THE WORLD'S LEADING SILICON FABS ARE EXPANDING THEIR CAPACITIES. Part 1 DOI: 10.22184/1992-4178.2022.212.1.58.66
Silicon fabs are increasingly becoming the backbone of the manufacturing base of the semiconductor industry, especially in the area of emerging process technologies. This business model is used by the world's largest microelectronic companies.
IC CONTRACT MANUFACTURING: THE WORLD'S LEADING SILICON FABS ARE EXPANDING THEIR CAPACITIES. Part 1 DOI: 10.22184/1992-4178.2022.212.1.58.66
Silicon fabs are increasingly becoming the backbone of the manufacturing base of the semiconductor industry, especially in the area of emerging process technologies. This business model is used by the world's largest microelectronic companies.
Tags: fabless industry fabless-индустрия globalfoundries intel samsung silicon fab smic tsmc кремниевый завод
Manufacturing equipment and process materials
S. Fedorov
NEW GENERATION OF EQUIPMENT IN "A-CONTRACT" PROVIDES MORE OPPORTUNITIES FOR CUSTOMERS DOI: 10.22184/1992-4178.2022.212.1.68.70
NEW GENERATION OF EQUIPMENT IN "A-CONTRACT" PROVIDES MORE OPPORTUNITIES FOR CUSTOMERS DOI: 10.22184/1992-4178.2022.212.1.68.70
Engineering solutions
A. Chernyshov
MULTILAYER PRINTED CIRCUIT BOARDS FROM PSB TECHNOLOGIES DOI: 10.22184/1992-4178.2022.212.1.72.77
The article considers by several examples the achievements of PSB Technologies LLC in the creation of multilayer printed circuit boards. It was noted that the company's specialists provide the implementation of projects even with seemingly technically unfeasible requirements.
MULTILAYER PRINTED CIRCUIT BOARDS FROM PSB TECHNOLOGIES DOI: 10.22184/1992-4178.2022.212.1.72.77
The article considers by several examples the achievements of PSB Technologies LLC in the creation of multilayer printed circuit boards. It was noted that the company's specialists provide the implementation of projects even with seemingly technically unfeasible requirements.
Tags: printed circuit board sequential pressing via переходное отверстие печатная плата последовательное прессование
CAD
K. Felton, D. Vertyanov, S. Evstafiev, V. Sidorenko
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS. Part 3 DOI: 10.22184/1992-4178.2022.212.1.80.84
The article considers the scalability and wide functionality necessary for the development of IC complex packages. It discusses the requirements for the transfer of the project to production that is the conditions for providing error-free production data for manufacturing and assembly.
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS. Part 3 DOI: 10.22184/1992-4178.2022.212.1.80.84
The article considers the scalability and wide functionality necessary for the development of IC complex packages. It discusses the requirements for the transfer of the project to production that is the conditions for providing error-free production data for manufacturing and assembly.
Tags: design flow design kit multichip assembly verification верификация комплект для проектирования маршрут проектирования многокристальная сборка
Test & Measurements
A. Voronin, I. Kudryashov
TEST AND CALIBRATION SYSTEMS FOR THE READOUT ELECTRONICS OF SILICON DETECTORS. Part 1 DOI: 10.22184/1992-4178.2022.212.1.86.95
The article discusses the main issues related to the testing and calibration of the readout electronics of silicon detectors for experiments in the field of high energy physics and cosmic ray physics, the design concept and structural solutions for test systems and hardware-software complexes for readout electronics.
TEST AND CALIBRATION SYSTEMS FOR THE READOUT ELECTRONICS OF SILICON DETECTORS. Part 1 DOI: 10.22184/1992-4178.2022.212.1.86.95
The article discusses the main issues related to the testing and calibration of the readout electronics of silicon detectors for experiments in the field of high energy physics and cosmic ray physics, the design concept and structural solutions for test systems and hardware-software complexes for readout electronics.
Tags: hardware-software complex internal calibration system probe station readout electronics silicon detector test board аппаратно-программный комплекс внутренняя калибровочная система зондовая установка кремниевый детектор считывающая электроника тестовая плата
Radio engineering systems
H. Yektaii, P. Pratt, F. Kearney
IMPLEMENTATION FEATURES OF THE DIGITAL PRE-DISTORTION METHOD IN MM-WAVE RADIO COMMUNICATION SYSTEMS DOI: 10.22184/1992-4178.2022.212.1.98.104
The article discusses the architectural features of mm-wave and sub-6 GHz base stations. Particular emphasis is paid to the implementation of the digital pre-distortion (DPD) method in these systems, which enable to increase the effective isotropic radiated power (EIRP) and reduce the number of antenna array elements for the same target EIRP.
IMPLEMENTATION FEATURES OF THE DIGITAL PRE-DISTORTION METHOD IN MM-WAVE RADIO COMMUNICATION SYSTEMS DOI: 10.22184/1992-4178.2022.212.1.98.104
The article discusses the architectural features of mm-wave and sub-6 GHz base stations. Particular emphasis is paid to the implementation of the digital pre-distortion (DPD) method in these systems, which enable to increase the effective isotropic radiated power (EIRP) and reduce the number of antenna array elements for the same target EIRP.
Tags: 5g new radio networks antenna array base station beamformer digital pre-distortion effective isotropic radiated power frequency converter frequency synthesizer millimeter wave frequencies антенная решетка базовая станция преобразователь частоты сети 5g new radio синтезатор частоты формирователь луча цифровые предыскажения частоты миллиметрового диапазона эффективная изотропная излучаемая мощность
Microwave electronics
K. Dzhurinsky, A. Sotnikov
RF CONNECTOR POWER CAPABILITY. THE SELECTION CRITERIA DOI: 10.22184/1992-4178.2022.212.1.106.117
The article is devoted to the substantiation of the selection criteria for radio frequency connectors on the basis of reference data. The main attention is paid to the problem of choosing connectors with allowable power capability.
RF CONNECTOR POWER CAPABILITY. THE SELECTION CRITERIA DOI: 10.22184/1992-4178.2022.212.1.106.117
The article is devoted to the substantiation of the selection criteria for radio frequency connectors on the basis of reference data. The main attention is paid to the problem of choosing connectors with allowable power capability.
Tags: frequency response power capability rf connectors пропускаемая мощность радиочастотные соединители частотная зависимость
Microprocessors and FPGAs
S. Aryashev, S. Vlasov, P. Zubkovsky, S. Sidorov
“KOMDIV-MK” MICROCONTROLLER DOI: 10.22184/1992-4178.2022.212.1.118.120
The article discusses the “Komdiv-MK” microcontroller produced by FGU Federal Research Center NIISI RAS. It features low power consumption and is intended primarily for use in Industrial IoT devices. The article provides information on the structure, characteristics and applications of the microcontroller.
“KOMDIV-MK” MICROCONTROLLER DOI: 10.22184/1992-4178.2022.212.1.118.120
The article discusses the “Komdiv-MK” microcontroller produced by FGU Federal Research Center NIISI RAS. It features low power consumption and is intended primarily for use in Industrial IoT devices. The article provides information on the structure, characteristics and applications of the microcontroller.
Reliability and tests
A. Strogonov, M. Belykh, D. Permyakov
ANALYSIS OF METHODS FOR CALCULATING THE OPERATIONAL FAILURE RATE OF LSI DOI: 10.22184/1992-4178.2022.212.1.122.129
The most popular in Russia guidance for predicting the failure rate of electronic systems are MIL-HDBK-217F US Department of Defense handbook and “Reliability of ERI” domestic reference guide. The article provides information on models and methods for assessing the failure rate of LSIs described in these handbooks, considers the examples of calculating the operational failure rate for some FPGAs.
ANALYSIS OF METHODS FOR CALCULATING THE OPERATIONAL FAILURE RATE OF LSI DOI: 10.22184/1992-4178.2022.212.1.122.129
The most popular in Russia guidance for predicting the failure rate of electronic systems are MIL-HDBK-217F US Department of Defense handbook and “Reliability of ERI” domestic reference guide. The article provides information on models and methods for assessing the failure rate of LSIs described in these handbooks, considers the examples of calculating the operational failure rate for some FPGAs.
Tags: cfr model failure rate fpga mtbf calculator parts count model parts stress model reliability prediction интенсивность отказов модель нагрузок модель с постоянной интенсивностью отказов модель экспресс-оценки плис прогнозирование надежности
V. Melnikov, N. Skripkin, S. Platonov, Yu. Polyakov
PREDICTING THE RELIABILITY OF NON-INCANDESCENT MAGNETRONS. TECHNICAL CAPABILITIES ENHANCEMENT DOI: 10.22184/1992-4178.2022.212.1.130.134
The mobile automated measuring complex (MAMC) developed by Pluton JSC allows you to monitor a number of parameters that have a critical impact on the reliability of the product and eliminate the influence of the human factor in the process of measuring its characteristics.
PREDICTING THE RELIABILITY OF NON-INCANDESCENT MAGNETRONS. TECHNICAL CAPABILITIES ENHANCEMENT DOI: 10.22184/1992-4178.2022.212.1.130.134
The mobile automated measuring complex (MAMC) developed by Pluton JSC allows you to monitor a number of parameters that have a critical impact on the reliability of the product and eliminate the influence of the human factor in the process of measuring its characteristics.
Tags: measuring complex non-incandescent magnetron reliability prediction безнакальный магнетрон измерительный комплекс прогнозирование надежности
T. Maksimov
TESTABLE DESIGNING AT OSTEC DOI: 10.22184/1992-4178.2022.212.1.138.141
By the example of Ostec’s own developments the article considers how, using the synthesis of in-circuit testing and boundary scan of electronic modules, to achieve 100% testability at the design step yet.
TESTABLE DESIGNING AT OSTEC DOI: 10.22184/1992-4178.2022.212.1.138.141
By the example of Ostec’s own developments the article considers how, using the synthesis of in-circuit testing and boundary scan of electronic modules, to achieve 100% testability at the design step yet.
Tags: boundary scan design in-circuit testing testability внутрисхемное тестирование периферийное сканирование проектирование тестопригодность
R. Zubarev, E. Gorbuntsov
TOOLING FROM ZPP JSC FOR DOMESTIC AND IMPORTED ELECTRONIC COMPONENTS DOI: 10.22184/1992-4178.2022.212.1.142.146
The article considers the contact devices and graphite fixture from Semiconductor Devices Plant JSC (ZPP JSC). It is noted that at the moment the task set by ZPP JSC to create a domestic production of contact devices and graphite fixture has been completed and the results obtained provide further development of these areas.
TOOLING FROM ZPP JSC FOR DOMESTIC AND IMPORTED ELECTRONIC COMPONENTS DOI: 10.22184/1992-4178.2022.212.1.142.146
The article considers the contact devices and graphite fixture from Semiconductor Devices Plant JSC (ZPP JSC). It is noted that at the moment the task set by ZPP JSC to create a domestic production of contact devices and graphite fixture has been completed and the results obtained provide further development of these areas.
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