rus
Adress to readers
V. Shpak
VECTORS FOR THE DEVELOPMENT OF DOMESTIC ELECTRONICS IN A GLOBAL CONTEXT DOI: 10.22184/1992-4178.2025.242.1.14.19
VECTORS FOR THE DEVELOPMENT OF DOMESTIC ELECTRONICS IN A GLOBAL CONTEXT DOI: 10.22184/1992-4178.2025.242.1.14.19
Competent opinion
M. Vakshtein
PLANNING THE DEVELOPMENT OF THE INDUSTRY AND BUILDING EFFECTIVE COOPERATION CHAINS IS LABORIOUS WORK ON WHICH THE FUTURE OF THE COUNTRY DEPENDS DOI: 10.22184/1992-4178.2025.242.1.20.27
PLANNING THE DEVELOPMENT OF THE INDUSTRY AND BUILDING EFFECTIVE COOPERATION CHAINS IS LABORIOUS WORK ON WHICH THE FUTURE OF THE COUNTRY DEPENDS DOI: 10.22184/1992-4178.2025.242.1.20.27
S. Gavrilov
HOW TO BUILD BRIDGES BETWEEN SCIENTIFIC RESEARCHES AND SERIAL PRODUCTION DOI: 10.22184/1992-4178.2025.242.1.28.32
HOW TO BUILD BRIDGES BETWEEN SCIENTIFIC RESEARCHES AND SERIAL PRODUCTION DOI: 10.22184/1992-4178.2025.242.1.28.32
P. Kutsko
THE SUCCESS AND PRESTIGE OF THE RUSSIAN ELECTRONICS INDUSTRY DEPENDS ON ALL OF US DOI: 10.22184/1992-4178.2025.242.1.34.38
THE SUCCESS AND PRESTIGE OF THE RUSSIAN ELECTRONICS INDUSTRY DEPENDS ON ALL OF US DOI: 10.22184/1992-4178.2025.242.1.34.38
Rules and Regulations
ENHANCEMENT OF LEGISLATION FOR PRICE SETTING OF PRODUCTS SUPPLIED UNDER THE STATE DEFENSE ORDER MEETING OF THE MILITARY AND INDUSTRIAL POLICY AND BUDGET SECTION OF THE EXPERT COUNCIL OF THE FEDERATION COUNCIL COMMITTEE ON DEFENSE AND SECURITY
DOI: 10.22184/1992-4178.2025.242.1.48.54
Exhibitions & Conferences
NEWS
Artificial Intelligence
S. Dvornikov, S. Dvornikov, I. Kirshina, O. Lifanova, O. Tikhonenkova
RECOGNITION OF CARDIAC SIGNALS USING NEURAL NETWORKS DOI: 10.22184/1992-4178.2025.242.1.136.142
The article considers the use of neural networks for recognizing
cardiac signals obtained from a phonendoscope. Information
is provided on the main stages of implementing the neural network
training procedures and making decisions during subsequent
classification. The results of processing cardiac signals using
statistical analysis and machine learning methods are presented.
RECOGNITION OF CARDIAC SIGNALS USING NEURAL NETWORKS DOI: 10.22184/1992-4178.2025.242.1.136.142
The article considers the use of neural networks for recognizing
cardiac signals obtained from a phonendoscope. Information
is provided on the main stages of implementing the neural network
training procedures and making decisions during subsequent
classification. The results of processing cardiac signals using
statistical analysis and machine learning methods are presented.
Tags: cardiac signals myocardial signal classification network training using the widrow- hoff learning rule neural network statistical processing кардиосигналы классификация сигналов миокарда нейронная сеть обучение сети по правилу видроу – хоффа статистическая обработка
Information and telecommunication systems
I. Korneev, Z. Kondrashov, A. Korneev, A. Kletsov
DEPLOYMENT OF A LOCAL NAVIGATION SYSTEM OUTSIDE THE PERIMETER OF THE RADIO NAVIGATION REFERENCE STATION NETWORK UNDER INTERFERENCE CONDITIONS DOI: 10.22184/1992-4178.2025.242.1.102.105
The article considers the provision of navigation for CONSUL system abonent, remote from the reference station within direct radio visibility, under the influence of an artificial interference source. A formula for the power of an interference source capable of suppressing a signal is derived.
DEPLOYMENT OF A LOCAL NAVIGATION SYSTEM OUTSIDE THE PERIMETER OF THE RADIO NAVIGATION REFERENCE STATION NETWORK UNDER INTERFERENCE CONDITIONS DOI: 10.22184/1992-4178.2025.242.1.102.105
The article considers the provision of navigation for CONSUL system abonent, remote from the reference station within direct radio visibility, under the influence of an artificial interference source. A formula for the power of an interference source capable of suppressing a signal is derived.
Tags: calculator program consul system interference source local navigation system reference station источник помех лнс программа-калькулятор рос система консул
Manufacturing equipment and process materials
I. Mandrik, I. Novozhilov
EQUIPMENT AND METHODS FOR SEMICONDUCTOR DIE MOUNTING DOI: 10.22184/1992-4178.2025.242.1.76.83
The article discusses equipment for high-precision mounting of semiconductor dies and the requirements imposed on it, and also provides information on various methods
of die mounting.
EQUIPMENT AND METHODS FOR SEMICONDUCTOR DIE MOUNTING DOI: 10.22184/1992-4178.2025.242.1.76.83
The article discusses equipment for high-precision mounting of semiconductor dies and the requirements imposed on it, and also provides information on various methods
of die mounting.
CAD
A.V. Strogonov, A. Vinokurov, A.I. Strogonov, A. Arsentiev
DEVELOPMENT OF A MULTI-CYCLE RISC-V MICROPROCESSOR CORE FOR IMPLEMENTATION ON THE CYCLONE V FPGA BASIS DOI: 10.22184/1992-4178.2025.242.1.96.100
The article discusses the development of a multi-cycle RISC-V microprocessor core with a control machine created using State Machine Editor in the Altera Quartus II CAD system for subsequent implementation on the Cyclone V series FPGA basis.
DEVELOPMENT OF A MULTI-CYCLE RISC-V MICROPROCESSOR CORE FOR IMPLEMENTATION ON THE CYCLONE V FPGA BASIS DOI: 10.22184/1992-4178.2025.242.1.96.100
The article discusses the development of a multi-cycle RISC-V microprocessor core with a control machine created using State Machine Editor in the Altera Quartus II CAD system for subsequent implementation on the Cyclone V series FPGA basis.
Tags: altera quartus ii cad cyclone v fpga risc-v architecture state machine editor архитектура risc-v плис cyclone v редактор конечных автоматов сапр altera quartus ii
Microwave electronics
K. Dzhurinsky
FOREIGN VERTICAL RF CONNECTORS FOR SOLDERLESS PCB MOUNTING DOI: 10.22184/1992-4178.2025.242.1.106.114
The article analyzes the design features of vertical microwave compression connectors for surface mounting without soldering on printed circuit boards. The advantages and disadvantages of these connectors are shown. Vertical connectors from USA, Europe and Southeast Asia are considered.
FOREIGN VERTICAL RF CONNECTORS FOR SOLDERLESS PCB MOUNTING DOI: 10.22184/1992-4178.2025.242.1.106.114
The article analyzes the design features of vertical microwave compression connectors for surface mounting without soldering on printed circuit boards. The advantages and disadvantages of these connectors are shown. Vertical connectors from USA, Europe and Southeast Asia are considered.
Tags: compression vertical connectors printed circuit boards rf connectors компрессионные вертикальные соединители печатные платы радиочастотные соединители
Microprocessors and FPGAs
V. Ezhov
REVIEW OF MICROCONTROLLERS FROM NIIET JSC AND PKK MILANDR JSC DOI: 10.22184/1992-4178.2025.242.1.84.92
The article presents an overview of microcontrollers produced by leading Russian companies developing integrated circuits – JSC NIIET and JSC PKK Milandr.
REVIEW OF MICROCONTROLLERS FROM NIIET JSC AND PKK MILANDR JSC DOI: 10.22184/1992-4178.2025.242.1.84.92
The article presents an overview of microcontrollers produced by leading Russian companies developing integrated circuits – JSC NIIET and JSC PKK Milandr.
Tags: eeprom flash memory microcontroller processor core ram risc/risc-v architecture архитектура risc/risc-v микроконтроллер озу процессорное ядро флеш-память
D. Chizhikov
NAVIGATION DESIGNS OF STC MODULE JSC: DEVELOPMENT PROSPECTS DOI: 10.22184/1992-4178.2025.242.1.94.95
The article presents a family of navigation modules developed
by STC Module JSC. The series features a universal design
ensuring the interchangeability of single-frequency, dual-frequency and triple-frequency modules without changing the printed circuit board topology. The prospects for the development of production of this equipment are considered.
NAVIGATION DESIGNS OF STC MODULE JSC: DEVELOPMENT PROSPECTS DOI: 10.22184/1992-4178.2025.242.1.94.95
The article presents a family of navigation modules developed
by STC Module JSC. The series features a universal design
ensuring the interchangeability of single-frequency, dual-frequency and triple-frequency modules without changing the printed circuit board topology. The prospects for the development of production of this equipment are considered.
Tags: form factor navigation module signal processor surface mount навигационный модуль поверхностный монтаж сигнальный процессор форм-фактор
Reliability and tests
S. Efimenko, N. Kovalchuk, V. Smolich
FEATURES OF BURN-IN TESTING OF SEMICONDUCTOR ELECTRONICS PRODUCTS DOI: 10.22184/1992-4178.2025.242.1.118.125
The article provides an overview and classification of equipment for burn-in testing in small-scale and serial production at electronics industry enterprises, as well as during incoming inspection at consumers. The main characteristics of burn-in test systems manufactured by domestic enterprises are presented.
FEATURES OF BURN-IN TESTING OF SEMICONDUCTOR ELECTRONICS PRODUCTS DOI: 10.22184/1992-4178.2025.242.1.118.125
The article provides an overview and classification of equipment for burn-in testing in small-scale and serial production at electronics industry enterprises, as well as during incoming inspection at consumers. The main characteristics of burn-in test systems manufactured by domestic enterprises are presented.
Tags: burn-in testing burn-in test system detection of hidden defects failure rate intermittent failures выявление скрытых дефектов интенсивность отказов перемежающиеся отказы стенд этт электротермотренировка
O. Chuprinova, Ya. Shchenikov
HARDWARE AND SOFTWARE COMPLEX FOR INTELLIGENT DIAGNOSTICS OF FAULTS IN ELECTRONIC ASSEMBLY UNITS DOI: 10.22184/1992-4178.2025.242.1.128.131
The article presents a hardware and software complex for intelligent diagnostics of faults in electronic assembly units using thermal imaging inspection method. The proposed solution includes Python software for data collection and processing. The developed complex
will allow for quick and effective detection of manufacturing defects.
HARDWARE AND SOFTWARE COMPLEX FOR INTELLIGENT DIAGNOSTICS OF FAULTS IN ELECTRONIC ASSEMBLY UNITS DOI: 10.22184/1992-4178.2025.242.1.128.131
The article presents a hardware and software complex for intelligent diagnostics of faults in electronic assembly units using thermal imaging inspection method. The proposed solution includes Python software for data collection and processing. The developed complex
will allow for quick and effective detection of manufacturing defects.
Tags: electronic assembly units intelligent diagnostics thermal imaging inspection method thermogram интеллектуальная диагностика метод теплового контроля термограмма электронные сборочные узлы
O. Chuprinova
AUTOMATION OF THERMAL METHOD OF RADIO-ELECTRONIC PRODUCT FINAL INSPECTION DOI: 10.22184/1992-4178.2025.242.1.132.135
The article discusses automation of thermal imaging inspection
of radio-electronic equipment (REE) using artificial neural networks
for processing thermal imaging measurements and industrial sensor
data. The proposed approach will optimize the diagnostic process
and reduce the time spent on troubleshooting.
AUTOMATION OF THERMAL METHOD OF RADIO-ELECTRONIC PRODUCT FINAL INSPECTION DOI: 10.22184/1992-4178.2025.242.1.132.135
The article discusses automation of thermal imaging inspection
of radio-electronic equipment (REE) using artificial neural networks
for processing thermal imaging measurements and industrial sensor
data. The proposed approach will optimize the diagnostic process
and reduce the time spent on troubleshooting.
Tags: artificial neural networks diagnostics of ree reliability thermal imaging inspection диагностика рэс искусственные нейронные сети надежность тепловой контроль
Production technologies
P. Varlamov
FOUR WAYS TO DECAPSULATE SEMICONDUCTOR DEVICES DOI: 10.22184/1992-4178.2025.242.1.70.74
Decapsulation is the removal of the component package without damaging the internal structure of the product and maintaining its functionality. The article discusses modern methods of decapsulation of semiconductor devices, their advantages and disadvantages, and methods of application.
FOUR WAYS TO DECAPSULATE SEMICONDUCTOR DEVICES DOI: 10.22184/1992-4178.2025.242.1.70.74
Decapsulation is the removal of the component package without damaging the internal structure of the product and maintaining its functionality. The article discusses modern methods of decapsulation of semiconductor devices, their advantages and disadvantages, and methods of application.
Tags: декапсуляция полупроводниковых приборов лазер механическое воздействие микроволновая плазма химическое травление
V. Lelyaev
MODERN METHODS OF REMOVING CONTAMINANTS FROM SUBSTRATES IN MICROELECTRONICS DOI: 10.22184/1992-4178.2025.242.1.64.68
The article discusses methods of liquid and dry cleaning of semiconductor substrates, features of the technological process and the equipment used.
MODERN METHODS OF REMOVING CONTAMINANTS FROM SUBSTRATES IN MICROELECTRONICS DOI: 10.22184/1992-4178.2025.242.1.64.68
The article discusses methods of liquid and dry cleaning of semiconductor substrates, features of the technological process and the equipment used.