WHAT IS THE PATH TO EFFICIENCY IN RUSSIAN INSTRUMENT MAKING? DOI: 10.22184/1992-4178.2025.243.2.12.20
30 YEARS OF HIGH TECHNOLOGY INTEGRATION INTO RUSSIAN INDUSTRY DOI: 10.22184/1992-4178.2025.243.2.22.24
NEW HOME OF THE LEADING RUSSIAN PRODUCER OF CHEMICALS AND EQUIPMENT FOR BARE BOARD MANUFACTURE VISIT TO THE PRODUCTION FACILITY OF ST. PETERSBURG CENTER ELMA LLC DOI: 10.22184/1992-4178.2025.243.2.50.62
EXPOELECTRONICA – 365 DAYS A YEAR. INNOVATIVE APPROACH TO FORMING THE INDUSTRY COMMUNITY DOI: 10.22184/1992-4178.2025.243.2.26.30
DEVELOPMENT OF DOMESTIC PRODUCTION OF PASSIVE COMPONENTS FOR CIVIL INDUSTRIES: CHALLENGES, TASKS AND NECESSARY STATE SUPPORT ENLARGED MEETING OF EXPERT BOARD OF “PASSIVE ELECTRONIC COMPONENTS” CONSORTIUM DOI: 10.22184/1992-4178.2025.243.2.32.40
MICROWAVE RADIOELECTRONICS – MOVING FORWARD SCIENCE AND TECHNOLOGY CONFERENCE “RESVCH-2024”. PART 1 DOI: 10.22184/1992-4178.2025.243.2.42.48
The article describes promising developments presented by participants of the conference «RESVCH-2024», dedicated to the 20th anniversary of Microwave Systems JSC. The first part of the work summarizes the materials of two sections. The reports of section 1 were devoted to modern technologies for the manufacture of microwave transistors and MIS. Section 2 discussed the designs, parameters of microwave components and issues of their reliability.
EVALUATION OF 3D FLASH LADAR TECHNOLOGY CAPABILITIES FOR USE IN ON-BOARD SENSORS FOR HIGHLY AUTOMATED VEHICLES DOI: 10.22184/1992-4178.2025.243.2.130.135
The article evaluates the range and measurement error of a lidar based on 3D Flash Ladar technology under background illumination condition at different wavelengths using different types of radiation sources and photodetectors.
SEMICONDUCTOR MANUFACTURING EQUIPMENT: STEADY GROWTH IN PURCHASES UNTIL 2027 DOI: 10.22184/1992-4178.2025.243.2.80.92
The global semiconductor industry is entering a new investment cycle: about $400 billion is planned to be spent on equipment purchases between 2025 and 2027. The growth in investment is due to the increasing demand for advanced semiconductor technologies.
SUNEAST IS A LEADER IN PCB SOLDERING EQUIPMENT DOI: 10.22184/1992-4178.2025.243.2.94.99
The article presents technical solutions from SUNEAST,
one of the top manufacturers of equipment for soldering printed circuit boards – convection ovens, selective soldering units, wave soldering machines.
PLANETARY MIXING TECHNOLOGY FOR THE PREPARATION OF SEALANTS AND OTHER MATERIALS DOI: 10.22184/1992-4178.2025.243.2.100.104
The article reviews the technology of planetary mixing, examines the design features and application of the Solo VKS M industrial/laboratory mixer from Protech for the preparation of sealing materials.
SOLDERING PASTE. LET’S PREPARE IT CORRECTLY! DOI: 10.22184/1992-4178.2025.243.2.106.109
The article examines the practice of correctly preparing
soldering paste and the recommended operation conditions,
based on hundreds of meetings with clients and taking into account situation in Russian production.
SOCIAL AND PSYCHOLOGICAL ASPECTS OF THE IMPLEMENTATION OF TECHNOLOGICAL EQUIPMENT MONITORING SYSTEMS AND THEIR IMPACT ON IMPROVING THE EFFICIENCY OF MACHINE-BUILDING ENTERPRISES The article studies the influence of technological equipment monitoring systems on the socio-psychological climate
and performance of machine-building enterprises. The experience
of implementing an information and measurement system at one
of the enterprises in the Tula region is presented.
BMTI IS A CHINESE ELECTRONIC COMPONENTS DESIGN INSTITUTE DOI: 10.22184/1992-4178.2025.243.2.122.125
BMTI is China’s largest research and development organization
in the field of microelectronic components for space and special purposes. The institute’s developments include a wide range
of highly reliable solutions for use in industries such as aerospace, aviation, nuclear industry, etc. The article provides an overview
of BMTI’s main product lines.
PROSPECTS FOR THE DEVELOPMENT OF A VERIFICATION FRAMEWORK AND STANDARDS FOR MULTISENSOR SYSTEMS DOI: 10.22184/1992-4178.2025.243.2.138.140
The state of the reference base for verification of multisensor systems is analyzed and the directions of its development are determined. The efficiency of using such systems in technology
and industry for simultaneous measurement
of several parameters is shown.
ANALYSIS OF MODELS AND METHODS FOR MEASURING RADON HAZARD INDICATORS IN THE RUSSIAN FEDERATION DOI: 10.22184/1992-4178.2025.243.2.142.144
The article presents an overview of methods for measuring radon hazard indicators of territories, as well as for radiation monitoring
of buildings and constructions in the Russian Federation.
The need to create and implement effective monitoring
tools to minimize risks associated with elevated
radon level is substantiated.
CLASSIFICATION OF UNDERLYING SURFACES USING VIDEO FRAMES FROM AVIATION GROUP TECHNICAL VISION SYSTEMS The article discusses a method for classifying underlying surfaces based on video frames generated in the forward viewing zone
of small aircraft systems using technical vision in the radio range. The developed procedure can be used in forestry and agriculture,
as well as for automated monitoring of emergency zones.
SIMULATION OF Si–SiO2 INTERFACE DEPASSIVATION IN LDMOS TRANSISTOR STRUCTURE USING SENTAURUS TCAD DOI: 10.22184/1992-4178.2025.243.2.116.120
The article discusses methods for predicting the degradation processes of LDMOS transistors during operation under various temperature conditions. Simulation of an LDMOS transistor
in Sentaurus TCAD showed that changing temperature conditions leads to different rates of degradation of transistor characteristics, such as threshold voltage and leakage current.
EXTREME SILICON WAFERS THINNING AND FORMATION OF NANO TSV FOR 3D HETEROGENEOUS INTEGRATION DOI: 10.22184/1992-4178.2025.243.2.112.114
The article considers the state-of-the art technologies that make
it possible to thin silicon wafers to 500 nm and form nano TSV
with dimensions of 180x250 nm and a depth of 500 nm.