rus
Issue #2/2024
R. Ermilov, Sh. Shugaepov, E. Ermolaev, V. Egoshin
IMPROVING THE RELIABILITY CHARACTERISTICS OF MULTI-LEAD METAL-CERAMIC PACKAGES FROM ZPP JSC THROUGH THE USE OF TEST SYSTEMS
IMPROVING THE RELIABILITY CHARACTERISTICS OF MULTI-LEAD METAL-CERAMIC PACKAGES FROM ZPP JSC THROUGH THE USE OF TEST SYSTEMS
DOI: 10.22184/1992-4178.2024.233.2.84.86
The article considers the test equipment that is used in Semiconductor Device Plant JSC (ZPP JSC) in the manufacture of multi-lead metal-ceramic IC packages.
The article considers the test equipment that is used in Semiconductor Device Plant JSC (ZPP JSC) in the manufacture of multi-lead metal-ceramic IC packages.
IMPROVING THE RELIABILITY CHARACTERISTICS OF MULTI-LEAD METAL-CERAMIC PACKAGES FROM ZPP JSC THROUGH THE USE OF TEST SYSTEMS
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