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DOI: 10.22184/1992-4178.2021.209.8.84.86
The article presents new types of metal-ceramic packages for power integrated circuits, which meet the up-to-date microelectronics requirements. The packages have been developed and mastered in production at Semiconductor Devices Plant JSC of the Republic of Mari El.
The article presents new types of metal-ceramic packages for power integrated circuits, which meet the up-to-date microelectronics requirements. The packages have been developed and mastered in production at Semiconductor Devices Plant JSC of the Republic of Mari El.
METAL-CERAMIC PACKAGES OF KT TYPE
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