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Issue #9/2021
K. Felton, D. Vertyanov, S. Evstafiev, V. Sidorenko
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS
DOI: 10.22184/1992-4178.2021.210.9.142.146
The article discusses new IC packaging solution, the digital twin concept. This is an electronic virtual model of a product being developed, which allows for integrated codesign at every stage of its development.
The article discusses new IC packaging solution, the digital twin concept. This is an electronic virtual model of a product being developed, which allows for integrated codesign at every stage of its development.
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS
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