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Issue #1/2022
K. Felton, D. Vertyanov, S. Evstafiev, V. Sidorenko
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS. Part 3
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS. Part 3
DOI: 10.22184/1992-4178.2022.212.1.80.84
The article considers the scalability and wide functionality necessary for the development of IC complex packages. It discusses the requirements for the transfer of the project to production that is the conditions for providing error-free production data for manufacturing and assembly.
The article considers the scalability and wide functionality necessary for the development of IC complex packages. It discusses the requirements for the transfer of the project to production that is the conditions for providing error-free production data for manufacturing and assembly.
Теги: design flow design kit multichip assembly verification верификация комплект для проектирования маршрут проектирования многокристальная сборка
THE NEXT GENERATION OF IC PACKAGING SOLUTIONS. Part 3
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