rus
Issue #5/2022
M. Makushin
TECHNOLOGICAL EQUIPMENT MARKET, THE ISSUES OF EUV LITHOGRAPHY AND ADVANCED PACKAGING METHODS
TECHNOLOGICAL EQUIPMENT MARKET, THE ISSUES OF EUV LITHOGRAPHY AND ADVANCED PACKAGING METHODS
DOI: 10.22184/1992-4178.2022.216.5.30.40
The article analyzes the market of technological equipment for IC manufacture and promising trends for the development of semiconductor equipment. The driving factors for the development of the equipment market are the increasing use of EUV lithography and advanced packaging methods.
The article analyzes the market of technological equipment for IC manufacture and promising trends for the development of semiconductor equipment. The driving factors for the development of the equipment market are the increasing use of EUV lithography and advanced packaging methods.
Теги: 2 200 mm and 300 mm manufacturing 200- и 300‑мм производство 2.5d and 3d packaging 5d- и 3d-корпусирование euv lithography euv-литография silicon fab кремниевый завод
TECHNOLOGICAL EQUIPMENT MARKET, THE ISSUES OF EUV LITHOGRAPHY AND ADVANCED PACKAGING METHODS
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